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TLP908(LB)

Marktech Optoelectronics

TLP908(LB) by Marktech Optoelectronics

Linear Position Sensors; Mounting Feature: THROUGH HOLE MOUNT; Maximum Operating Temperature: 85 Cel; Output Circuit Type: Transistor; Maximum VCEsat: .4 V; Maximum Output Current: .75 A;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Linear Position Sensors TLP908(LB) attributes and parameters. Explore more Linear Position Sensors devices from Marktech Optoelectronics

Specs

JESD-609 Code:

e0

Mounting Feature:

No. of Channels:

1

Maximum Operating Current:

50 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Circuit Type:

Transistor

Maximum Output Current:

.75 A

Sub-Category:

Position, Linear, Photoelectric Sensors

Terminal Finish:

Tin/Lead (Sn/Pb)

Maximum VCEsat:

.4 V

Manufacturer Highlights

Marktech Optoelectronics

Founded in 1985, the privately held, Marktech Optoelectronics is a well-established world-class provider of detector and emitter engineering, design, manufacturing, packaging, burn-in testing, and sorting with production facilities in the USA and Japan. Marktech’s founding members leveraged their deep knowledge of industrial markets and the technical needs of design engineers to rapidly grow and expand into many industries requiring advanced photonics devices. Today, Marktech Optoelectronics is one of the world’s leading manufacturers of UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters and photodiode detectors. The company also engineers and manufactures materials such as silicon photodetector wafers, chips, and InP epiwafers. In the infrared wavelength ranges, Marktech is a vertically integrated manufacturer growing epitaxy InP wafers, fabricating InGaAs detector and emitter chips, packaging chips, and even producing completed assemblies for some OEM customers. Marktech has leading-edge packaging capabilities with the ability to package die in molded plastic through-hole, SMD, chip-scale, TO can, chip on board (COB), and their proprietary seam-welded hermetic ATLAS package. Marktech’s advanced packaging capabilities can produce multiple die components including designs with multi-wavelength emitters, multiple detectors for broadband detection, and emitter-detector combinations.

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