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TLP1002A

Marktech Optoelectronics

TLP1002A by Marktech Optoelectronics

Other Optoelectronics; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Gap Size: 5 mm; Output Circuit Type: Transistor; Maximum Operating Temperature: 85 Cel;

Median Price

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Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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32,000

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 4,458 parts In-Stock

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4,458

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Continental Prestige Electronics

USA . 3,756 parts In-Stock

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3,756

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

Other Function Optoelectronics TLP1002A attributes and parameters. Explore more Other Function Optoelectronics devices from Marktech Optoelectronics

Specs

Gap Size:

5 mm

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Circuit Type:

Transistor

Sub-Category:

Other Optoelectronics

Trade Compliance

TLP1002A Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Marktech Optoelectronics

Founded in 1985, the privately held, Marktech Optoelectronics is a well-established world-class provider of detector and emitter engineering, design, manufacturing, packaging, burn-in testing, and sorting with production facilities in the USA and Japan. Marktech’s founding members leveraged their deep knowledge of industrial markets and the technical needs of design engineers to rapidly grow and expand into many industries requiring advanced photonics devices. Today, Marktech Optoelectronics is one of the world’s leading manufacturers of UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters and photodiode detectors. The company also engineers and manufactures materials such as silicon photodetector wafers, chips, and InP epiwafers. In the infrared wavelength ranges, Marktech is a vertically integrated manufacturer growing epitaxy InP wafers, fabricating InGaAs detector and emitter chips, packaging chips, and even producing completed assemblies for some OEM customers. Marktech has leading-edge packaging capabilities with the ability to package die in molded plastic through-hole, SMD, chip-scale, TO can, chip on board (COB), and their proprietary seam-welded hermetic ATLAS package. Marktech’s advanced packaging capabilities can produce multiple die components including designs with multi-wavelength emitters, multiple detectors for broadband detection, and emitter-detector combinations.

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