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LMS7002M-REEL

Lime Microsystems

LMS7002M-REEL by Lime Microsystems

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 261; Package Code: BGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Other Function Telecom Interface ICs LMS7002M-REEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Lime Microsystems

Specs

JESD-30 Code:

S-PBGA-B261

Length:

11.5 mm

No. of Functions:

1

No. of Terminals:

261

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

11.5 mm

Manufacturer Highlights

Lime Microsystems

Lime Microsystems specialises in field programmable RF (FPRF) transceivers, SDR platforms and ecosystem technology for the next generation of wireless broadband systems. These products offer an unprecedented level of configurability and allow system designers to create wireless communication networking equipment that can be set and reconfigured to run on any wireless communications frequency and mobile standard.

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