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LFE5U-45F-6BG554C

Lattice Semiconductor

LFE5U-45F-6BG554C by Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 554; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

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Technical Specifications

Field Programmable Gate Arrays (FPGA) LFE5U-45F-6BG554C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

44000

No. of Inputs:

245

No. of Outputs:

245

No. of CLBs:

5500

Organization:

5500 CLBS

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.045 V

Maximum Supply Voltage:

1.155 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

1.76 mm

Package Equivalence Code:

BGA554,26X26,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

554

Standards

JESD-30 Code:

S-PBGA-B554

JESD-609 Code:

e1

Trade Compliance

LFE5U-45F-6BG554C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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