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LCMXO2-7000HC-4BG256C

Lattice Semiconductor

LCMXO2-7000HC-4BG256C by Lattice Semiconductor

LCMXO2-7000HC-4BG256C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 6864 logic cells. It has a max supply voltage of 3.465V and can operate in temperatures up to 85°C. This FPGA is commonly used for various applications requiring programmable ICs and high-performance logic circuits.

Median Price

$26.510

Lifecycle Status

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Mouser Electronics

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Future Electronics

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Nova Conductors

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Ampacity Inc.

Singapore . 377 parts In-Stock

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Semicontronic

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Continental Prestige Electronics

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Microchip USA

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Corohmni

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Aztec Data Supply Inc.

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Advanced Electronics

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Argo Parts USA

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Netroflash

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ChipstoGo Electronic ltd

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Overview

Discover the power of the LCMXO2-7000HC-4BG256C by Lattice Semiconductor, a cutting-edge Field Programmable Gate Array (FPGA) that offers unmatched quality and performance. With its 6864 logic cells and 206 inputs and outputs, this FPGA is designed to deliver optimal results for a wide range of applications. Its plastic/epoxy package body material ensures durability, while its low profile and fine pitch package style make it easy to integrate into any design. Backed by Lattice Semiconductor's reputation for excellence, this FPGA provides customers with value, benefits, and advantages that are simply unbeatable. Experience the future of programmable ICs with the LCMXO2-7000HC-4BG256C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and resistance to damage, making this FPGA suitable for various applications.

No. of Logic Cells: 6864

With a high number of logic cells, this FPGA provides ample space for complex designs and allows for the implementation of advanced functions and algorithms.

Surface Mount: YES

The surface mount feature simplifies the installation and integration process, offering convenience and ease of use.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage allows for the utilization of power-hungry components and ensures reliable performance in demanding scenarios.

No. of Inputs: 206

With a large number of inputs, this FPGA can accommodate extensive input signals and enable complex data processing and manipulation.

Package Shape: SQUARE

The square package shape offers efficient space utilization and better compatibility with various mounting arrangements.

Form Of Terminal: BALL

The ball terminal form enhances electrical connectivity and facilitates secure soldering, providing reliable connections in the system.

Nominal Supply Voltage (V): 2.5

The stable nominal supply voltage allows for consistent and predictable operation, enhancing the overall reliability of the FPGA.

Packing Method: TRAY

The tray packing method ensures safe transportation and storage, minimizing the risk of damage during handling and shipping.

Power Supplies (V): 2.5/3.3

This FPGA supports multiple power supply voltages, offering flexibility and compatibility across a range of systems and environments.

No. of Terminals: 256

With a sufficient number of terminals, this FPGA enables effective connectivity with other components, facilitating seamless integration into the overall system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The field-programmable gate array design allows for customization and reconfiguration, enabling adaptability and scalability for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides compactness, efficient signal routing, and high-density integration capabilities.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage allows for efficient power consumption and enables operation in low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions, ensuring reliable performance under thermal stress.

Pitch Of Terminal: 0.8 mm

The small terminal pitch facilitates compact circuit board designs and supports high-density interconnectivity for optimized system layouts.

Minimum Operating Temperature: 0 °C

The wide minimum operating temperature range allows for reliable operation even in extreme cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finishing with tin, silver, and copper enhances electrical conductivity and corrosion resistance, ensuring long-lasting performance.

Position Of Terminal: BOTTOM

The terminal positioned at the bottom facilitates easier PCB layout and assembly, enabling efficient board design and production processes.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this FPGA can withstand moderate exposure to moisture during manufacturing and assembly stages.

Maximum Seated Height: 1.7 mm

The low maximum seated height ensures compatibility with compact devices and allows for space-saving integration in various applications.

Width: 14 mm

The compact width dimension enables flexibility in board layout and provides compatibility with space-constrained designs.

No. of Outputs: 206

With a substantial number of outputs, this FPGA can drive multiple output signals efficiently, supporting complex system configurations and signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

The FPGA can withstand the peak reflow temperature for up to 30 seconds during the soldering process, ensuring proper solder joint formation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for compatibility with lead-free soldering processes, ensuring compliance with industry standards.

Length: 14 mm

The compact length dimension facilitates space-saving integration and enables flexibility in PCB layout designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2-7000HC-4BG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

6864

No. of Inputs:

206

No. of Outputs:

206

Sub-Category:

Field Programmable Gate Arrays

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Power Supplies:

2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2-7000HC-4BG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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