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LCMXO2-1200UHC-5FTG256I

Lattice Semiconductor

LCMXO2-1200UHC-5FTG256I by Lattice Semiconductor

LCMXO2-1200UHC-5FTG256I by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. It operates b/w -40 to 100°C, has 206 inputs/outputs, and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-speed processing in industrial automation and telecommunications sectors.

Median Price

$20.625

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 90 parts In-Stock

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$20.600

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$18.200

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$15.900

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Mouser Electronics

USA . 195 parts In-Stock

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$20.650

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$17.330

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DigiKey

USA . 83 parts In-Stock

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$20.650

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$16.700

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USA . 3,150 parts In-Stock

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Verical

USA . 90 parts In-Stock

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$16.660

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Flip Electronics

USA . 3,150 parts In-Stock

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Vyrian

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Nova Conductors

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Corohmni

South Africa . 5 parts In-Stock

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$15.730

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Semicontronic

India . 686 parts In-Stock

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$17.550

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$17.111

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$17.024

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Microchip USA

USA . 2,520 parts In-Stock

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$19.200

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Ampacity Inc.

Singapore . 980 parts In-Stock

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$38.200

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Aztec Data Supply Inc.

USA . 3,548 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Overview

Unlock the potential of your next project with the LCMXO2-1200UHC-5FTG256I by Lattice Semiconductor. As a leading manufacturer in Field Programmable Gate Arrays (FPGA), Lattice Semiconductor delivers top-quality products that guarantee reliability and performance. With 1280 logic cells and 206 inputs/outputs, this FPGA offers endless possibilities in various applications. Whether you're designing cutting-edge electronics or optimizing industrial processes, the LCMXO2-1200UHC-5FTG256I provides the flexibility and power you need to bring your ideas to life. Experience the value and advantages of this innovative product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

No. of Logic Cells: 1280

The high number of logic cells allows for complex designs and efficient processing, making the product versatile and powerful.

Surface Mount: YES

Surface mount technology makes installation and assembly easier, saving time and effort during production.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage allows for flexibility in power requirements, accommodating a variety of operating conditions.

No. of Inputs: 206

The large number of inputs enables the product to receive and process a wide range of signals, increasing its utility and functionality.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy integration into circuit layouts, optimizing design and layout flexibility.

Form Of Terminal: BALL

Ball terminals provide secure connections and precise contact points, ensuring reliable performance and ease of installation.

Nominal Supply Voltage (V): 2.5

The stable nominal supply voltage ensures consistent and reliable operation, reducing the risk of voltage-related issues or malfunctions.

Packing Method: TRAY

Tray packaging protects the product during shipping and handling, reducing the risk of damage and ensuring product quality upon arrival.

Power Supplies (V): 2.5/3.3

The multiple power supply options allow for compatibility with different systems and voltage requirements, increasing the product's versatility and applicability.

No. of Terminals: 256

The high number of terminals provides ample connectivity options and increased versatility in circuit design and integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA offers flexibility in application-specific programming, allowing for customization and optimization in various use cases.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies layout and connections, facilitating efficient design and assembly processes.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage provides energy efficiency and allows for operation in low-power scenarios, reducing overall power consumption and cost.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability and performance in demanding, high-temperature environments, expanding the product's range of applications.

Pitch Of Terminal: 1 mm

The small terminal pitch enables compact design and layout, maximizing space efficiency and enabling high-density integration.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in cold environments, making the product suitable for a wide range of operating conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple terminal finishing materials ensures reliable and high-quality connections, minimizing the risk of corrosion or signal loss.

Position Of Terminal: BOTTOM

The bottom terminal position facilitates easy and secure connections, enhancing installation and ensuring stable performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, making the product suitable for standard manufacturing and handling practices.

Maximum Seated Height: 1.55 mm

The low seated height allows for compact and slim designs, saving space and enabling integration in tight or limited spaces.

Width: 17 mm

The compact width ensures compatibility with various PCB layouts and space constraints, offering flexibility in design and integration.

Maximum Clock Frequency: 133 MHz

The high maximum clock frequency enables fast and efficient processing, supporting high-performance applications and demanding computational tasks.

No. of Outputs: 206

The large number of outputs allows for versatile signal routing and processing options, enhancing the product's functionality and performance capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and connection reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures secure and durable solder joints, contributing to long-term product reliability and performance.

Length: 17 mm

The compact length allows for space-efficient design and integration, enabling flexible placement and layout options in various applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2-1200UHC-5FTG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

1280

No. of Inputs:

206

No. of Outputs:

206

Maximum Clock Frequency:

133 MHz

Sub-Category:

Field Programmable Gate Arrays

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Power Supplies:

2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Packing Method:

Tray

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2-1200UHC-5FTG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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