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PEF3460E

Lantiq

PEF3460E by Lantiq

ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,008 parts In-Stock

1+ parts

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1k+ parts

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1,008

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Digiode

USA . 1,003 parts In-Stock

1+ parts

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100+ parts

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1,003

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 900 parts In-Stock

1+ parts

$8.058

100+ parts

-

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900

$8.058

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Modulus Dynamics

Lithuania . 2,657 parts In-Stock

1+ parts

$8.779

100+ parts

$8.428

1k+ parts

$8.077

10k+ parts

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2,657

$8.779

$8.428

$8.077

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Texas Native Microelectronics

USA . 10 parts In-Stock

1+ parts

$9.262

100+ parts

$8.892

1k+ parts

$8.614

10k+ parts

$8.151

10

$9.262

$8.892

$8.614

$8.151

Kenton Components

USA . 3,699 parts In-Stock

1+ parts

$11.114

100+ parts

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1k+ parts

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$9.781

3,699

$11.114

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$9.781

Qasali Group International

UK . 799 parts In-Stock

1+ parts

$25.007

100+ parts

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1k+ parts

$23.257

10k+ parts

$22.007

799

$25.007

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$23.257

$22.007

Corphita

USA . 960 parts In-Stock

1+ parts

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960

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Technical Specifications

ATM/SONET/SDH Circuits PEF3460E attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Lantiq

Specs

JESD-30 Code:

S-PBGA-B272

Length:

27 mm

No. of Functions:

1

No. of Terminals:

272

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

PEF3460E Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Lantiq

Nevada January 6, 2015. REUTERS/Rick Wilking FRANKFURT (Reuters) - Intel has agreed to buy German network chipmaker Lantiq for an undisclosed amount to expand its range of chips used in Internet-connected gadgets, the companies said on Monday. The former Infineon unit was bought in 2009 by private equity firm Golden Gate Capital for 250 million euros ($280 million). Deutsche Telekom was among the companies invested in Lantiq through Golden Gate. Adding Internet connections to devices ranging from soccer balls to household and industrial machines, a trend dubbed the Internet of Things or M2M, has become a new battleground for Intel, Qualcomm and other technology companies. The number of wireless gadgets will more than double by the end of the decade, with most of the growth coming from smart devices other than PCs and smartphones, according to market research firm ABI Research. Lantiq also produces chips for copper, fiber and hybrid copper-fiber connections as well as mobile broadband and Wi-Fi which it sells to broadband access and telecom carrier equipment providers.Technology firms are betting heavily on Internet device-connected homes for future revenues and profit. Last year Samsung Electronics paid $200 million for U.S.-based start-up SmartThings, which makes software that helps control everything from door locks to light switches in homes.

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