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PEF24471HTSI-XL

Lantiq

PEF24471HTSI-XL by Lantiq

DIGITAL TIME SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: BGA; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,091 parts In-Stock

1+ parts

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1k+ parts

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1,091

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Digiode

USA . 944 parts In-Stock

1+ parts

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944

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Distributors (Availability)

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MARBEL Systems

Belgium . 16 parts In-Stock

1+ parts

$6.025

100+ parts

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16

$6.025

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Texas Native Microelectronics

USA . 1,267 parts In-Stock

1+ parts

$6.925

100+ parts

$6.648

1k+ parts

$6.440

10k+ parts

$6.094

1,267

$6.925

$6.648

$6.440

$6.094

Kenton Components

USA . 300 parts In-Stock

1+ parts

$8.310

100+ parts

-

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10k+ parts

$7.313

300

$8.310

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$7.313

Modulus Dynamics

Lithuania . 3,892 parts In-Stock

1+ parts

$14.674

100+ parts

$14.087

1k+ parts

$13.500

10k+ parts

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3,892

$14.674

$14.087

$13.500

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Qasali Group International

UK . 30 parts In-Stock

1+ parts

$18.698

100+ parts

-

1k+ parts

$17.389

10k+ parts

$16.454

30

$18.698

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$17.389

$16.454

Corphita

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Technical Specifications

Telecom - Switching ICs PEF24471HTSI-XL attributes and parameters. Explore more Telecom - Switching ICs devices from Lantiq

Specs

JESD-30 Code:

S-PBGA-B217

JESD-609 Code:

e0

Length:

23 mm

No. of Functions:

1

No. of Terminals:

217

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

PEF24471HTSI-XL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Lantiq

Nevada January 6, 2015. REUTERS/Rick Wilking FRANKFURT (Reuters) - Intel has agreed to buy German network chipmaker Lantiq for an undisclosed amount to expand its range of chips used in Internet-connected gadgets, the companies said on Monday. The former Infineon unit was bought in 2009 by private equity firm Golden Gate Capital for 250 million euros ($280 million). Deutsche Telekom was among the companies invested in Lantiq through Golden Gate. Adding Internet connections to devices ranging from soccer balls to household and industrial machines, a trend dubbed the Internet of Things or M2M, has become a new battleground for Intel, Qualcomm and other technology companies. The number of wireless gadgets will more than double by the end of the decade, with most of the growth coming from smart devices other than PCs and smartphones, according to market research firm ABI Research. Lantiq also produces chips for copper, fiber and hybrid copper-fiber connections as well as mobile broadband and Wi-Fi which it sells to broadband access and telecom carrier equipment providers.Technology firms are betting heavily on Internet device-connected homes for future revenues and profit. Last year Samsung Electronics paid $200 million for U.S.-based start-up SmartThings, which makes software that helps control everything from door locks to light switches in homes.

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