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T530X477M006ATE0107280

KEMET Corporation

T530X477M006ATE0107280 by KEMET Corporation

KEMET T530X477M006ATE0107280 is a 470uF, 6.3V tantalum capacitor with low ESR of 10mohm and tan delta of 0.08. Ideal for applications requiring high ripple current (1300mA) and operating temperatures from -55 to 125°C in SMT designs.

Median Price

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1k+

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Vyrian

USA . 10,353 parts In-Stock

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Nova Conductors

Japan . 88 parts In-Stock

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Semicontronic

India . 987 parts In-Stock

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$0.010

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Corohmni

South Africa . 197 parts In-Stock

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Aztec Data Supply Inc.

USA . 66 parts In-Stock

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Ampacity Inc.

Singapore . 705 parts In-Stock

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AZTECH Wire

Italy . 301 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Experience top-tier quality and reliability with the T530X477M006ATE0107280 by KEMET Corporation, a leading manufacturer in the industry. This fixed capacitor, featuring tantalum solid polymer dielectric material, is designed to deliver superior performance and efficiency in various applications. Offering a high ripple current of 1300 mA and low leakage current of 0.2961 mA, this capacitor ensures optimal functionality and durability. Trust KEMET Corporation to provide you with a product that exceeds expectations and enhances your projects with unmatched value and benefits.

Feature Benefit Bullets

Dielectric Material: TANTALUM (SOLID POLYMER)

Tantalum capacitors are known for their high stability, reliability, and long lifespan, making them a great choice for various electronic applications.

Ripple Current (mA): 1300

With a high ripple current rating, this capacitor can effectively filter noise and provide stable voltage output in applications with high frequency AC signals.

Capacitance: 470 uF

High capacitance value allows this capacitor to store and discharge large amounts of electrical energy, suitable for applications requiring smooth power delivery.

Rated DC Voltage (URdc): 6.3 V

This capacitor is designed to handle a maximum DC voltage of 6.3V, making it suitable for low voltage circuits and applications.

Equivalent Series Resistance / ESR (mohm): 10

Low ESR value indicates minimal energy loss and efficient performance, ensuring the capacitor operates effectively in high-frequency applications.

Package Style (Meter): SMT

Surface mount technology allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Polarity: POLARIZED

Polarized design ensures correct orientation during installation, preventing damage to the capacitor and ensuring proper functionality.

Technical Specifications

Fixed Capacitors T530X477M006ATE0107280 attributes and parameters. Explore more Fixed Capacitors devices from KEMET Corporation

Specs

Additional Features:

ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

Capacitance:

Capacitor Type:

Dielectric Material:

Equivalent Series Resistance / ESR (mohm ):

10

Height:

4 mm

JESD-609 Code:

e3

Leakage Current (mA):

0.2961

Length:

7.3 mm

Mounting Feature:

Negative Tolerance:

20 %

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Package Shape:

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Packing Method:

TR, EMBOSSED PLASTIC, 13 INCH

Polarity:

POLARIZED

Positive Tolerance:

20 %

Rated DC Voltage (URdc):

Ripple Current (mA):

1300

Size Code:

2917

Tan Delta:

0.08

Terminal Finish:

MATTE TIN

Terminal Shape:

J BEND

Width:

4.3 mm

Trade Compliance

T530X477M006ATE0107280 Capacitors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8532.21.00.50

SB

8532.21.00.50

Manufacturer Highlights

KEMET Corporation

KEMET Corporation is an American electronics company that specializes in the design, manufacturing, and distribution of capacitors, electromagnetic compatibility solutions, and other electronic components. The company was founded in 1919 and is headquartered in Fort Lauderdale, Florida, with manufacturing facilities and sales offices around the world. KEMET Corporation and its subsidiaries (KEMET), is a wholly owned subsidiary of Yageo Corporation (TAIEX: 2327).

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Management team

CEO

William M. Lowe, Jr.

Executive VP & CFO

Gregory C. Thompson

Executive VP & President - TOKIN Corporation

Shigenori (Sean) Oyama

Manufacturer fab locations 25

Fab name Location Fab Initiation Wafer Capacity

Advanced Tantalum Manufacturing

Fabrication

Fab Initiation

-

USA

Simpsonville

Wafer Capacity

382

-

382

FELCO

Fabrication

Fab Initiation

-

USA

Chicago

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

USA

Fort Lauderdale

Wafer Capacity

61

-

61

-

Fabrication

Fab Initiation

-

Indonesia

Batam

Wafer Capacity

68

-

68

-

Fabrication

Fab Initiation

-

China

Anting-Shanghai

Wafer Capacity

73

-

73

-

Fabrication

Fab Initiation

-

Mexico

Matamoros

Wafer Capacity

286

-

286

-

Fabrication

Fab Initiation

-

Mexico

Ciudad Victoria

Wafer Capacity

265

-

265

Guadalupe

Fabrication

Fab Initiation

-

Mexico

Monterrey

Wafer Capacity

532

-

532

San Nicolas

Fabrication

Fab Initiation

-

Mexico

Monterrey

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

North Macedonia

Skopje

Wafer Capacity

126

-

126

Plant A

Fabrication

Fab Initiation

-

China

Suzhou

Wafer Capacity

353

-

353

Plant B

Fabrication

Fab Initiation

-

China

Suzhou

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

China

Xiamen

Wafer Capacity

432

-

432

-

Fabrication

Fab Initiation

-

Italy

Pontecchio

Wafer Capacity

226

-

226

-

Fabrication

Fab Initiation

-

Portugal

Evora

Wafer Capacity

233

-

233

TOKIN

Fabrication

Fab Initiation

-

Vietnam

Biên Hòa City

Wafer Capacity

174

-

174

TOKIN

Fabrication

Fab Initiation

-

Thailand

Hom Sin

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

Thailand

Chachoengsao

Wafer Capacity

171

-

171

TOKIN

Fabrication

Fab Initiation

-

Japan

Sendai

Wafer Capacity

378

-

378

TOKIN

Fabrication

Fab Initiation

-

Japan

Toyama

Wafer Capacity

-

-

Fabrication

Fab Initiation

-

Japan

Nyuzen

Wafer Capacity

209

-

209

-

Fabrication

Fab Initiation

-

Japan

Shiroishi

Wafer Capacity

378

-

378

-

Fabrication

Fab Initiation

-

Finland

Suomussalmi

Wafer Capacity

56

-

56

-

Fabrication

Fab Initiation

-

Bulgaria

Kyustendil

Wafer Capacity

86

-

86

-

Fabrication

Fab Initiation

-

Sweden

Farjestaden

Wafer Capacity

28

-

28

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