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RB521G-30

Jiangsu Changjiang Electronics Technology

RB521G-30 by Jiangsu Changjiang Electronics Technology

RECTIFIER DIODE; Surface Mount: YES; No. of Elements: 1; Technology: SCHOTTKY; Maximum Output Current: .1 A; Maximum Repetitive Peak Reverse Voltage: 30 V;

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,162 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Semicontronic

India . 781 parts In-Stock

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$0.010

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$0.010

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781

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.015

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40

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Aztec Data Supply Inc.

USA . 302 parts In-Stock

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$0.080

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302

$0.080

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AZTECH Wire

Italy . 814 parts In-Stock

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$12.997

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Kepictronics

USA . 79,000 parts In-Stock

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iodParts Technologies Inc.

India . 10,500 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,707 parts In-Stock

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Assy Fe

Spain . 5,400 parts In-Stock

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Argo Parts USA

USA . 3,170 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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Modulus Dynamics

Lithuania . 86 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Technical Specifications

Diodes & Rectifiers RB521G-30 attributes and parameters. Explore more Diodes & Rectifiers devices from Jiangsu Changjiang Electronics Technology

Specs

Config:

SINGLE

Diode Type:

Maximum Forward Voltage (VF):

.35 V

Maximum Non Repetitive Peak Forward Current:

1 A

No. of Elements:

1

No. of Phases:

1

Maximum Operating Temperature:

125 Cel

Maximum Output Current:

.1 A

Maximum Repetitive Peak Reverse Voltage:

30 V

Sub-Category:

Rectifier Diodes

Surface Mount:

YES

Technology:

SCHOTTKY

Trade Compliance

RB521G-30 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Jiangsu Changjiang Electronics Technology

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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