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BAP64-05

Jiangsu Changjiang Electronics Technology

BAP64-05 by Jiangsu Changjiang Electronics Technology

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Inventory MP

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Bristol Electronics

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Anansix

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Digiode

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Pegasus Components GmbH

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Vyrian

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One Stop Electronics

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Kepictronics

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UNI Independent Distributors

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A-Z Elektronik GmbH

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Assy Fe

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Alle Elektronik GmbH

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Native Components

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Technical Specifications

PIN Diodes BAP64-05 attributes and parameters. Explore more PIN Diodes devices from Jiangsu Changjiang Electronics Technology

Specs

Additional Features:

HIGH VOLTAGE

Application:

ATTENUATOR; SWITCHING

Config:

COMMON CATHODE, 2 ELEMENTS

Nominal Diode Capacitance:

.52 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

1.35 ohm

Diode Resistive Test Current:

100 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-G3

Nominal Minority Carrier Lifetime:

1.55 us

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.25 W

Reverse Test Voltage:

0 V

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Form:

Terminal Position:

Trade Compliance

BAP64-05 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Jiangsu Changjiang Electronics Technology

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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