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ISL78302AR1AZ

Intersil

ISL78302AR1AZ by Intersil

FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

Median Price

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Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 988 parts In-Stock

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988

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Distributors (Availability)

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Microchip USA

USA . 3,352 parts In-Stock

1+ parts

$7.381

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3,352

$7.381

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Component Stockers USA

USA . 7,594 parts In-Stock

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$14.040

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7,594

$14.040

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Supply Digital

USA . 1,254 parts In-Stock

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1,254

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Technical Specifications

Fixed Regulators - Positive Multiple Output LDO ISL78302AR1AZ attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Intersil

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ISL78302AR1AZ Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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