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ISL32496EIBZ-T

Intersil

ISL32496EIBZ-T by Intersil

LINE TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$4.685

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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DigiKey

USA . 4,207 parts In-Stock

1+ parts

$3.780

100+ parts

$2.367

1k+ parts

$2.111

10k+ parts

$2.047

4,207

$3.780

$2.367

$2.111

$2.047

Renesas

USA . 7,365 parts In-Stock

1+ parts

$5.590

100+ parts

$2.741

1k+ parts

$2.482

10k+ parts

$2.053

7,365

$5.590

$2.741

$2.482

$2.053

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.320

100+ parts

-

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10

$3.320

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Vyrian

USA . 7,205 parts In-Stock

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7,205

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Distributors (Availability)

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Corohmni

South Africa . 693 parts In-Stock

1+ parts

$3.320

100+ parts

-

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693

$3.320

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Continental Prestige Electronics

USA . 5,831 parts In-Stock

1+ parts

$3.320

100+ parts

-

1k+ parts

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10k+ parts

$3.254

5,831

$3.320

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-

$3.254

Argo Parts USA

USA . 2,296 parts In-Stock

1+ parts

$3.320

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-

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2,296

$3.320

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Ampacity Inc.

Singapore . 7,327 parts In-Stock

1+ parts

$4.750

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7,327

$4.750

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Semicontronic

India . 6,962 parts In-Stock

1+ parts

$4.750

100+ parts

$4.631

1k+ parts

$4.608

10k+ parts

-

6,962

$4.750

$4.631

$4.608

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Aztec Data Supply Inc.

USA . 3,212 parts In-Stock

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$10.674

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3,212

$10.674

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Component Stockers USA

USA . 780 parts In-Stock

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$99.990

100+ parts

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780

$99.990

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iodParts Technologies Inc.

India . 166,543 parts In-Stock

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166,543

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QUARKTWIN TECHNOLOGY LTD

USA . 29,937 parts In-Stock

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29,937

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Microchip USA

USA . 5,118 parts In-Stock

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5,118

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Perfect Parts

USA . 2,772 parts In-Stock

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2,772

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Supply Digital

USA . 1,182 parts In-Stock

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1,182

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Technical Specifications

Line Drivers & Receivers ISL32496EIBZ-T attributes and parameters. Explore more Line Drivers & Receivers devices from Intersil

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485; EIA-422

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

.8 V

Maximum Output Low Current:

6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

80 ns

Width:

3.9 mm

Trade Compliance

ISL32496EIBZ-T Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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