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HIN211EIBZ

Intersil

HIN211EIBZ by Intersil

LINE TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$3.230

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Renesas

USA . 5 parts In-Stock

1+ parts

$2.890

100+ parts

$2.127

1k+ parts

$1.811

10k+ parts

$1.396

5

$2.890

$2.127

$1.811

$1.396

Mouser Electronics

USA . 977 parts In-Stock

1+ parts

$3.570

100+ parts

$1.870

1k+ parts

$1.580

10k+ parts

$1.350

977

$3.570

$1.870

$1.580

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rebound Electronics

UK . 208 parts In-Stock

1+ parts

-

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208

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Inventory MP

USA . 201 parts In-Stock

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201

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Bristol Electronics

USA . 201 parts In-Stock

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201

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ComSIT Distribution GmbH

Germany . 102 parts In-Stock

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102

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Distributors (Availability)

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Component Stockers USA

USA . 2,456 parts In-Stock

1+ parts

$2.840

100+ parts

$2.130

1k+ parts

$1.820

10k+ parts

-

2,456

$2.840

$2.130

$1.820

-

Microchip USA

USA . 2,256 parts In-Stock

1+ parts

$19.695

100+ parts

-

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2,256

$19.695

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Native Components

USA . 604 parts In-Stock

1+ parts

$69.285

100+ parts

-

1k+ parts

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10k+ parts

$66.514

604

$69.285

-

-

$66.514

Northwest PG Solutions

USA . 1,364 parts In-Stock

1+ parts

$76.214

100+ parts

-

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1,364

$76.214

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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Perfect Parts

USA . 1,166 parts In-Stock

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1,166

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A-Z Elektronik GmbH

Germany . 471 parts In-Stock

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471

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Supply Digital

USA . 422 parts In-Stock

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422

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Eastek

USA . 145 parts In-Stock

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GreenTree Electronics

Israel . 145 parts In-Stock

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Technical Specifications

Line Drivers & Receivers HIN211EIBZ attributes and parameters. Explore more Line Drivers & Receivers devices from Intersil

Specs

Differential Output:

NO

Driver No. of Bits:

4

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-E; V.28

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

10000 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

10000 ns

Width:

7.5 mm

Trade Compliance

HIN211EIBZ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intersil

Japanese semiconductor company Renesas acquired Intersil on February 24, 2017. Intersil Corporation (NASDAQ:ISIL), a wholly owned subsidiary of Renesas Electronics Corporation, is a leading provider of innovative power management and precision analog solutions. The company's products form the building blocks of increasingly intelligent, mobile and power hungry electronics enabling advances in power management to improve efficiency and extend battery life. With a deep portfolio of intellectual property and a rich history of design and process innovation, Intersil is the trusted partner to leading companies in some of the world's largest markets, including the industrial and infrastructure, mobile computing, automotive and aerospace.

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