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PF48F2000W0ZBQ0

Intel

PF48F2000W0ZBQ0 by Intel

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 9 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,750

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Digiode

USA . 1,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,590

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

MARBEL Systems

Belgium . 300 parts In-Stock

1+ parts

$1.795

100+ parts

-

1k+ parts

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10k+ parts

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300

$1.795

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Texas Native Microelectronics

USA . 407 parts In-Stock

1+ parts

$2.063

100+ parts

$1.980

1k+ parts

$1.919

10k+ parts

$1.815

407

$2.063

$1.980

$1.919

$1.815

Kenton Components

USA . 2,843 parts In-Stock

1+ parts

$2.476

100+ parts

-

1k+ parts

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10k+ parts

$2.179

2,843

$2.476

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-

$2.179

Qasali Group International

UK . 300 parts In-Stock

1+ parts

$5.570

100+ parts

-

1k+ parts

$5.180

10k+ parts

$4.902

300

$5.570

-

$5.180

$4.902

Corphita

USA . 390 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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390

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Technical Specifications

Flash Memory PF48F2000W0ZBQ0 attributes and parameters. Explore more Flash Memory devices from Intel

Specs

Maximum Access Time:

70 ns

Additional Features:

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

Boot Block:

BOTTOM

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

9 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

8,127

No. of Terminals:

56

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA88,8X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Page Size (words):

4

Parallel or Serial:

PARALLEL

Power Supplies (V):

1.8/3

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sector Size (Words):

4K,32K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Toggle Bit:

NO

Type:

NOR TYPE

Width:

7.7 mm

Trade Compliance

PF48F2000W0ZBQ0 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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