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MD8274

Intel

MD8274 by Intel

SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: WDIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

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4

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< 1k

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Digiode

USA . 346 parts In-Stock

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J2 Sourcing AB

Sweden . 286 parts In-Stock

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Vyrian

USA . 92 parts In-Stock

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Odintec Ltd.

Israel . 2 parts In-Stock

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MARBEL Systems

Belgium . 944 parts In-Stock

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$13.591

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Texas Native Microelectronics

USA . 5,803 parts In-Stock

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$15.622

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$14.528

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$13.747

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Kenton Components

USA . 1,231 parts In-Stock

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$18.746

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$16.497

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Qasali Group International

UK . 10 parts In-Stock

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$42.179

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A-Z Elektronik GmbH

Germany . 5,784 parts In-Stock

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Corphita

USA . 262 parts In-Stock

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Technical Specifications

Serial Communication Controllers MD8274 attributes and parameters. Explore more Serial Communication Controllers devices from Intel

Specs

Address Bus Width:

2

Boundary Scan:

NO

Bus Compatibility:

MCS 48; MCS 85; MCS 51; IAPX 86; IAPX 88; IAPX 186; IAPX 188

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC

Maximum Data Transfer Rate:

.107421875 MBps

External Data Bus Width:

8

JESD-30 Code:

R-GDIP-T40

JESD-609 Code:

e0

Length:

52.325 mm

No. of Serial I/Os:

2

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.72 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

240 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

HMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

MD8274 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5331-00-097-6410, 5331000976410, 5962-01-435-3377, 5962014353377

NIIN

000976410, 014353377

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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