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EP20K400FC672-1X

Intel

EP20K400FC672-1X by Intel

EP20K400FC672-1X by Intel is a PLD with 16640 logic cells, 2.5 ns propagation delay, and 496 inputs/outputs. Ideal for applications requiring fast processing speeds and high logic capacity in a compact GRID ARRAY package.

Median Price

$45.000

Lifecycle Status

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Vyrian

USA . 907 parts In-Stock

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Nova Conductors

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Semicontronic

India . 673 parts In-Stock

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$4.875

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$4.850

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Ampacity Inc.

Singapore . 269 parts In-Stock

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One Stop Electronics

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MARBEL Systems

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Kenton Components

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Modulus Dynamics

Lithuania . 1,095 parts In-Stock

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Qasali Group International

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Texas Native Microelectronics

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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Glotronic Ltd.

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Supply Digital

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A-Z Elektronik GmbH

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Perfect Parts

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Aranea Global

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Vigor

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Overview

Unlock endless possibilities with the EP20K400FC672-1X by Intel, a top-of-the-line Programmable Logic Device that boasts unparalleled quality and reliability. Designed by industry-leading manufacturer Intel, this PLD is perfect for a wide range of applications, offering customers the flexibility and customization they need to bring their projects to life. With lightning-fast propagation delay and a multitude of logic cells, this device delivers exceptional performance and efficiency. Trust Intel to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the device, making it suitable for various environments.

Propagation Delay: 2.5 ns

Fast propagation delay ensures quick response times in processing signals, improving the overall performance of the device.

No. of Logic Cells: 16640

Large number of logic cells allow for complex logic functions to be implemented, making the device versatile for different applications.

Surface Mount: YES

Surface mount technology makes it easy to integrate this device onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.625 V

The maximum supply voltage of 2.625 V ensures safe operation and prevents damage to the device, providing reliability in use.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable in noisy environments.

No. of Inputs: 496

Large number of input pins allow for versatile connectivity options, accommodating various input signals for processing.

Package Shape: SQUARE

Square package shape provides a compact form factor, making it easy to fit into tight spaces on a circuit board.

Form Of Terminal: BALL

Ball terminal configuration allows for secure connections and easy soldering, ensuring reliable electrical connections.

Nominal Supply Voltage (V): 2.5

Stable nominal supply voltage of 2.5 V ensures consistent performance and compatibility with other components in the system.

Power Supplies (V): 2.5,2.5/3.3

Multiple power supply options provide flexibility in voltage requirements, accommodating different power sources for operation.

No. of Terminals: 672

High number of terminals offer ample connectivity options, allowing for versatile integration with other components in a circuit.

Programmable IC Type: LOADABLE PLD

Loadable PLD allows for reprogramming of logic functions, enabling customization and adaptability to changing requirements.

Package Style (Meter): GRID ARRAY

Grid array package style provides a high density of terminals in a compact layout, optimizing space and facilitating easy routing of connections.

Output Function: MACROCELL

Macrocell output function offers complex logic operations and flexibility in designing custom logic circuits, enhancing the device's functionality.

Minimum Supply Voltage: 2.375 V

Minimum supply voltage of 2.375 V ensures reliable operation even at lower voltages, providing flexibility in power source requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures stable performance in a wide range of environmental conditions.

Pitch Of Terminal: 1 mm

Terminal pitch of 1 mm allows for compact layout and efficient use of space, enabling high-density integration on a circuit board.

Organization: 502 I/O

502 I/O organization provides a large number of input/output options, offering versatility in connecting to external devices and components.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures reliable performance even in cold environments, making the device suitable for a wide range of applications.

Finishing Of Terminal Used: TIN LEAD

Tin lead terminal finishing offers good solderability and corrosion resistance, ensuring long-term reliability in electrical connections.

Position Of Terminal: BOTTOM

Bottom terminal position simplifies the assembly process and allows for easy access to terminals during installation and maintenance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent moisture-related damage.

Maximum Seated Height: 2.1 mm

Low maximum seated height of 2.1 mm facilitates compact design and slim profile, making it suitable for applications with space constraints.

Width: 27 mm

Width of 27 mm provides a compact form factor, allowing for easy integration into circuit board layouts with limited space.

No. of Outputs: 496

High number of output pins offer flexibility in routing output signals, enabling the device to drive multiple external components or subsystems.

Length: 27 mm

Length of 27 mm complements the compact width, providing a square form factor that can be easily accommodated in circuit board designs.

No. of I/O Lines: 502

502 I/O lines offer a balanced mix of input and output options, providing versatility in connecting to external devices and peripherals.

Technical Specifications

Programmable Logic Devices (PLD) EP20K400FC672-1X attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel

IC Features

Programmable IC Type:

Organization:

502 I/O

No. of Outputs:

496

Output Function:

Macrocell

No. of Inputs:

496

No. of Logic Cells:

16640

No. of I/O Lines:

502

Propagation Delay:

2.5 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

2.625 V

Power Supplies (V):

2.5,2.5/3.3 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA672,26X26,40

Width:

27 mm

Length:

27 mm

Maximum Seated Height:

2.1 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

672

Terminal Pitch:

1 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PBGA-B672

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

EP20K400FC672-1X Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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