Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EP20K400FC672-1X by Intel is a PLD with 16640 logic cells, 2.5 ns propagation delay, and 496 inputs/outputs. Ideal for applications requiring fast processing speeds and high logic capacity in a compact GRID ARRAY package.
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PLASTIC/EPOXY material provides durability and protection to the device, making it suitable for various environments.
Fast propagation delay ensures quick response times in processing signals, improving the overall performance of the device.
Large number of logic cells allow for complex logic functions to be implemented, making the device versatile for different applications.
Surface mount technology makes it easy to integrate this device onto circuit boards, saving space and simplifying the assembly process.
The maximum supply voltage of 2.625 V ensures safe operation and prevents damage to the device, providing reliability in use.
CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable in noisy environments.
Large number of input pins allow for versatile connectivity options, accommodating various input signals for processing.
Square package shape provides a compact form factor, making it easy to fit into tight spaces on a circuit board.
Ball terminal configuration allows for secure connections and easy soldering, ensuring reliable electrical connections.
Stable nominal supply voltage of 2.5 V ensures consistent performance and compatibility with other components in the system.
Multiple power supply options provide flexibility in voltage requirements, accommodating different power sources for operation.
High number of terminals offer ample connectivity options, allowing for versatile integration with other components in a circuit.
Loadable PLD allows for reprogramming of logic functions, enabling customization and adaptability to changing requirements.
Grid array package style provides a high density of terminals in a compact layout, optimizing space and facilitating easy routing of connections.
Macrocell output function offers complex logic operations and flexibility in designing custom logic circuits, enhancing the device's functionality.
Minimum supply voltage of 2.375 V ensures reliable operation even at lower voltages, providing flexibility in power source requirements.
High maximum operating temperature of 85°C ensures stable performance in a wide range of environmental conditions.
Terminal pitch of 1 mm allows for compact layout and efficient use of space, enabling high-density integration on a circuit board.
502 I/O organization provides a large number of input/output options, offering versatility in connecting to external devices and components.
Low minimum operating temperature of 0°C ensures reliable performance even in cold environments, making the device suitable for a wide range of applications.
Tin lead terminal finishing offers good solderability and corrosion resistance, ensuring long-term reliability in electrical connections.
Bottom terminal position simplifies the assembly process and allows for easy access to terminals during installation and maintenance.
MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent moisture-related damage.
Low maximum seated height of 2.1 mm facilitates compact design and slim profile, making it suitable for applications with space constraints.
Width of 27 mm provides a compact form factor, allowing for easy integration into circuit board layouts with limited space.
High number of output pins offer flexibility in routing output signals, enabling the device to drive multiple external components or subsystems.
Length of 27 mm complements the compact width, providing a square form factor that can be easily accommodated in circuit board designs.
502 I/O lines offer a balanced mix of input and output options, providing versatility in connecting to external devices and peripherals.
Programmable Logic Devices (PLD) EP20K400FC672-1X attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
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EP20K400FC672-1X Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317T/NOPB
Texas Instruments
LM317T/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount with three terminals for easy installation.
Transistor & Electronic
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS303C
Idec
ROTARY SWITCH;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
Vishay Telefunken
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
Philips Components
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
SLG46880-AP
Renesas Electronics
SLG46880-AP by Renesas Electronics is a 12 macrocell OT PLD with 20 inputs and outputs. Operating at -40 to 125 °C, it's AEC-Q100 compliant for automotive applications. With a square shape and no lead terminals, it's ideal for compact designs in harsh environments.
EPM1270M256C5N
Altera
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: RECTANGULAR;
5M240ZT144I5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
ATF1508AS-10QU100
Atmel
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
EPM570ZM100C6N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
XC95288XL-7TQG144C
Xilinx
The Xilinx XC95288XL-7TQG144C is a FLASH PLD with 288 macro cells, 117 I/O lines, and 125 MHz max clock frequency. Ideal for applications requiring in-system programmability, it operates at temperatures from 0 to 70°C and has a propagation delay of 7.5 ns.
EPM240ZM100C6N
ATF1508ASV-15JU84
Microchip Technology
Microchip Technology's ATF1508ASV-15JU84 is a 128 macro cell EE PLD with 64 I/O lines. It has a propagation delay of 15 ns, operates at a max clock frequency of 100 MHz, and supports JTAG boundary scan testing. Ideal for industrial applications requiring fast processing speeds and high I/O capabilities.
5M570ZF256C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
EPF10K50RI240-4N
Intel
EPF10K50RI240-4N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 189 inputs. Ideal for industrial applications, it operates at -40 to 85 °C with a clock frequency of 62.89 MHz. The package style includes flatpack and heat sink/slug options in a square shape with gull wing terminals.
GAL16V8D-10LPN
Lattice Semiconductor
GAL16V8D-10LPN by Lattice Semiconductor is a PLD with 10ns propagation delay, 5.25V max supply voltage, and CMOS technology. Ideal for applications requiring PAL-type architecture, it offers 18 inputs, 8 I/O lines, and operates at up to 66.7MHz clock frequency.
LC4032V-5TN48I
LC4032V-5TN48I by Lattice Semiconductor is a 32 macrocell EE PLD with 36 inputs and 32 I/O lines. Featuring a propagation delay of 5 ns, it operates at a max clock frequency of 156 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in environments ranging from -40 to 105°C.
5M160ZE64C4N
The 5M160ZE64C4N by Altera is a programmable logic device with 128 macro cells. It has a propagation delay of 7.9 ns and a maximum clock frequency of 184.1 MHz. The device operates at a nominal supply voltage of 1.8V and has a minimum supply voltage of 1.71V. It is surface mountable, has 54 I/O lines, and uses CMOS technology. This PLD is suitable for applications requiring in-system programmability and output functions such as macrocells.
EPM1270T144C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
5M80ZE64C4N
Intel's 5M80ZE64C4N is a FLASH PLD with 64 macro cells, 7.9 ns propagation delay, and 184.1 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as high-speed digital designs or embedded systems development.
ATF1504ASV-15AU44
ATF1504ASV-15AU44 by Microchip Technology is a 3.3V EE PLD with 32 I/O lines, 15ns propagation delay, and 100MHz max clock frequency. Ideal for industrial applications requiring macrocell output functions in a square-shaped, thin-profile package with Gull Wing terminals.
EPM570ZM100C7N
EPM570ZM100C7N by Intel is a FLASH PLD with 440 macro cells, 76 I/O lines, and 15.1 ns propagation delay. It is ideal for applications requiring programmable logic devices with in-system programmability and JTAG boundary scan testing capabilities.
LC4128ZC-75TN100C
LC4128ZC-75TN100C by Lattice Semiconductor is a 128 macrocell EE PLD with 7.5 ns propagation delay, 74 inputs, and 64 I/O lines. It features in-system programmability, JTAG boundary scan test support, and operates at a max clock frequency of 111 MHz. Ideal for applications requiring fast processing speeds and high I/O capabilities in compact designs.
EPM1270GT144C4N
The Altera EPM1270GT144C4N is a programmable logic device with 980 macro cells, CMOS technology, and a propagation delay of 8.1 ns. It can operate at a maximum supply voltage of 1.89V and has a package shape of square. This PLD is commonly used for applications requiring in-system programmability and output functions like macrocell.
ATF1502AS-7AX44
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
EP20K160ETC144-2X
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
EP20K100EQC240-2N
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE;
EP20K30EFC324-3
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
EP20K400FC672-1X
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
EP20K200EQC208-2X
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP20K100EBC356-2X
LOADABLE PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 356; Package Code: LBGA; Package Shape: SQUARE;
EP20K100EBC356-3
EP20K100EBC356-3N
EP20K100EQC240-2X
EP20K200EQI240-2X
LOADABLE PLD; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE; Power Supplies (V): 1.8,1.8/3.3;
LOADABLE PLD; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE; Propagation Delay: 1.97 ns;
EP20K100EQC208-1X
EP20K400FC672-1XN
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