Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel's 5M2210ZF256C4 is a FLASH PLD with 1700 macro cells, 203 inputs/outputs, and 247.5 MHz clock frequency. Ideal for applications requiring fast propagation delay of 9.1 ns, such as high-speed digital signal processing and telecommunications systems. It features in-system programmability and JTAG boundary scan test capabilities for efficient development and testing processes.
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PLASTIC/EPOXY material provides durability and protection for the PLD, ensuring long-term reliability.
Fast propagation delay of 9.1 ns allows for quick response times in processing data.
Large number of macro cells allow for complex logic functions to be implemented.
CMOS technology offers low power consumption and high noise immunity.
High number of inputs enable various data inputs to be processed efficiently.
Stable supply voltage of 1.8V ensures consistent performance.
High maximum clock frequency of 247.5 MHz allows for fast processing of data.
JTAG Boundary Scan Test capability enables efficient testing and debugging of the PLD.
Large number of I/O lines provide versatile connectivity options for interfacing with external devices.
Programmable Logic Devices (PLD) 5M2210ZF256C4 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
Programmable IC Type:
In-System Programmable:
Organization:
No. of Outputs:
Output Function:
No. of Inputs:
No. of Macro Cells:
No. of Dedicated Inputs:
No. of I/O Lines:
Maximum Clock Frequency:
Propagation Delay:
Technology:
Sub-Category:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies (V):
Maximum Operating Temperature:
Minimum Operating Temperature:
Temprature Grade:
Package Body Material:
Package Style (Meter):
Package Code:
Package Shape:
Package Equivalence Code:
Width:
Length:
Maximum Seated Height:
Terminal Position:
Terminal Form:
No. of Terminals:
Terminal Pitch:
Terminal Finish:
JESD-30 Code:
JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
5M2210ZF256C4 Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev Software Chgs 3/Jun/2021 Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
1N4148WS
Sangdest Microelectronics (Nanjing)
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS140T3G
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
XC2C64A-7CPG56C
Xilinx
XC2C64A-7CPG56C by Xilinx is a 64 macrocell FLASH PLD with 7.5 ns propagation delay, operating at 200 MHz. It features in-system programmability, 45 I/O lines, and JTAG boundary scan test for versatile applications in programmable logic devices (PLD) requiring low profile grid array packaging.
EPM7064AETC44-10N
Altera
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
XC2C64A-5QFG48C
Xilinx XC2C64A-5QFG48C is a 64 macrocell FLASH PLD with 5 ns propagation delay, operating at max 333 MHz. Ideal for applications requiring in-system programmability and JTAG boundary scan test capability. Package style: chip carrier, very thin profile.
EPM570GT100C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
EPM1270F256I5N
Intel
The Intel EPM1270F256I5N is a FLASH PLD with 980 macro cells, 212 inputs/outputs, and 10ns propagation delay. Ideal for applications requiring programmable logic devices in a compact grid array package with JTAG boundary scan test capability.
XC95144XL-7TQ144I
XC95144XL-7TQ144I by Xilinx is a programmable logic device with 144 macro cells and 117 inputs/outputs. It operates at a max clock frequency of 138.88 MHz and is commonly used in industrial applications for its in-system programmability and low profile package style.
EPM240ZM100C6N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: SQUARE;
EPM7256SRI208-10N
The EPM7256SRI208-10N by Altera is a programmable logic device with 256 macro cells, a propagation delay of 10 ns, and a maximum clock frequency of 125 MHz. It can be surface mounted and has a package shape of a square. This device is commonly used in industrial applications due to its wide temperature range and JTAG boundary scan test capability.
EPF10K100ARI240-3N
LOADABLE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: HFQFP; Package Shape: SQUARE;
ATF1502ASL-25JU44
Microchip Technology
ATF1502ASL-25JU44 by Microchip Technology is a 5.5V PLD with 32 macro cells, 36 inputs, and 32 I/O lines. Ideal for PAL-type applications, it offers a propagation delay of 25ns and max clock frequency of 30.3MHz. This square-shaped EE PLD in chip carrier package is in-system programmable for versatile usage scenarios.
EPM7032SLC44-10N
The Altera EPM7032SLC44-10N is a 32 macrocell EE PLD with 36 I/O lines, operating at up to 125 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring fast processing speeds and versatile I/O capabilities in commercial-grade environments.
ATF1504ASL-25AU44
Microchip Technology's ATF1504ASL-25AU44 is a 5.5V PLD with 25ns propagation delay, 64 macro cells, and 32 inputs/outputs. Ideal for industrial applications, it features in-system programmability, JTAG boundary scan test support, and operates at temperatures ranging from -40 to 85°C.
EPM7064AETI44-7N
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
ISPLSI1048E-70LQN
Lattice Semiconductor
ISPLSI1048E-70LQN by Lattice Semiconductor is a PLD with 192 macro cells, 96 I/O lines, and 18.5 ns propagation delay. It is used for applications requiring in-system programmability, such as digital signal processing and control systems. The device operates at temperatures ranging from 0 to 70°C and has a max clock frequency of 56 MHz.
EPM3128ATI100-10N
EPM3128ATI100-10N by Intel is a 128 macrocell EE PLD with 80 I/O lines. It operates at a max clock frequency of 98 MHz and has a propagation delay of 10 ns. This programmable logic device is ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
EPM240T100I3N
FLASH PLD; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Additional Features: IT CAN ALSO OPERATE AT 3.3V;
EPM570GM100C5N
EPM570GM100C5N by Intel is a FLASH PLD with 440 macro cells, 76 I/O lines, and 8.7 ns propagation delay. Ideal for applications requiring programmable logic devices with low power consumption and high-speed processing capabilities.
XC9572XL-10VQG44C
The Xilinx XC9572XL-10VQG44C is a 3.3V programmable logic device with 72 macro cells and 34 I/O lines. It features a propagation delay of 10ns, operates at a max clock frequency of 100MHz, and supports in-system programmability. Ideal for applications requiring high-speed processing and flexibility in design configurations.
ATF1504ASVL-20JU44
EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
GAL22V10D-10QPN
GAL22V10D-10QPN by Lattice Semiconductor is a 5V CMOS PLD with 10ns propagation delay, 132 product terms, and 83.3MHz clock frequency. Ideal for PAL-type applications requiring EE PLDs in commercial extended temperature environments.
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5M2210ZF256C5N
Intel's 5M2210ZF256C5N is a PLD with 1700 macro cells, 203 inputs/outputs, and 201.1 MHz clock frequency. Ideal for applications requiring fast propagation delay of 11.2 ns, such as high-speed digital designs or signal processing systems. Features include in-system programmability and JTAG boundary scan testing for efficient development and debugging processes.
5M2210ZF256I5N
Intel's 5M2210ZF256I5N is a FLASH PLD with 1700 macro cells, 203 I/O lines, and 201.1 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing capabilities.
5M2210ZF256C4N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
5M2210ZF324C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE;
5M2210ZF324C4N
Intel's 5M2210ZF324C4N is a FLASH PLD with 1700 macro cells, 271 I/O lines, and 247.5 MHz clock frequency. Ideal for applications requiring fast propagation delay of 9.1 ns, such as high-speed digital systems and communication devices. Its CMOS technology and in-system programmability make it versatile for various design needs.
5M2210ZF256I5
Intel's 5M2210ZF256I5 is a FLASH PLD with 1700 macro cells, 203 I/O lines, and max clock frequency of 201.1 MHz. Ideal for industrial applications requiring high-speed data processing and low power consumption. Features JTAG boundary scan test for efficient debugging and in-system programmability for flexibility.
5M2210ZF256C5
5M2210ZF324I5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE;
5M2210ZF324C4
5M2210ZF324A5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
5M2210ZF256A5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
5M2210ZF324I5
5M2210ZF324C5
5M2210ZF256C4
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
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