Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Intel's 5M2210ZF256C4 is a FLASH PLD with 1700 macro cells, 203 inputs/outputs, and 247.5 MHz clock frequency. Ideal for applications requiring fast propagation delay of 9.1 ns, such as high-speed digital signal processing and telecommunications systems. It features in-system programmability and JTAG boundary scan test capabilities for efficient development and testing processes.
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PLASTIC/EPOXY material provides durability and protection for the PLD, ensuring long-term reliability.
Fast propagation delay of 9.1 ns allows for quick response times in processing data.
Large number of macro cells allow for complex logic functions to be implemented.
CMOS technology offers low power consumption and high noise immunity.
High number of inputs enable various data inputs to be processed efficiently.
Stable supply voltage of 1.8V ensures consistent performance.
High maximum clock frequency of 247.5 MHz allows for fast processing of data.
JTAG Boundary Scan Test capability enables efficient testing and debugging of the PLD.
Large number of I/O lines provide versatile connectivity options for interfacing with external devices.
Programmable Logic Devices (PLD) 5M2210ZF256C4 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Intel
Programmable IC Type:
In-System Programmable:
Organization:
No. of Outputs:
Output Function:
No. of Inputs:
No. of Macro Cells:
No. of Dedicated Inputs:
No. of I/O Lines:
Maximum Clock Frequency:
Propagation Delay:
Technology:
Sub-Category:
Nominal Supply Voltage:
Minimum Supply Voltage:
Maximum Supply Voltage:
Power Supplies (V):
Maximum Operating Temperature:
Minimum Operating Temperature:
Temprature Grade:
Package Body Material:
Package Style (Meter):
Package Code:
Package Shape:
Package Equivalence Code:
Width:
Length:
Maximum Seated Height:
Terminal Position:
Terminal Form:
No. of Terminals:
Terminal Pitch:
Terminal Finish:
JESD-30 Code:
JESD-609 Code:
JTAG Boundary Scan Test:
Qualified:
5M2210ZF256C4 Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Mult Dev Software Chgs 3/Jun/2021 Quartus SW/Web Chgs 23/Sep/2021
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
1554216004
Molex
WIRE AND CABLE;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
General Semiconductor
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Diodes Incorporated
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
XCR3128XL-7VQ100I
Xilinx
Xilinx XCR3128XL-7VQ100I is a 128 macrocell EE PLD with 84 I/O lines. It operates at max clock freq of 119 MHz, with propagation delay of 7.5 ns. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing.
EPM240T100C3N
Intel
Intel's EPM240T100C3N is a PLD with 192 macro cells, 80 inputs/outputs, and 4.7ns propagation delay. Ideal for applications requiring fast processing speeds and high input/output capabilities in compact designs.
EPM240T100I4N
EPM240T100I4N by Intel is a 192 macrocell FLASH PLD with 80 inputs/outputs. It operates at a max supply voltage of 2.625V, offering a propagation delay of 6.1ns. Ideal for applications requiring in-system programmability and JTAG boundary scan testing in compact designs.
EP1K50TC144-2N
Altera
LOADABLE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
M4A3-64/32-55VNC
Lattice Semiconductor
M4A3-64/32-55VNC by Lattice Semiconductor is a programmable logic device (PLD) with 64 macro cells and a max clock frequency of 105 MHz. It has a propagation delay of 5.5 ns and can be used for applications requiring in-system programmability and output function control.
5M80ZE64A5N
Intel's 5M80ZE64A5N is a PLD with 64 macro cells, 14ns propagation delay, and CMOS technology. Ideal for industrial applications, it offers in-system programmability and JTAG boundary scan testing. With a temperature range of -40 to 105°C, this device is suitable for various electronic systems.
ATF16V8B-10JU
Atmel
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;
LC4128V-75TN100C
LC4128V-75TN100C by Lattice Semiconductor is a 3.3V EE PLD with 128 macro cells, 74 inputs, and 64 I/O lines. With a propagation delay of 7.5ns and max clock frequency of 111MHz, it's ideal for applications requiring fast processing speeds in programmable logic devices. The device is surface mountable and features JTAG boundary scan test capability for efficient testing processes.
ATF22V10C-10PU
Microchip Technology
ATF22V10C-10PU by Microchip Technology is a 5.5V CMOS PLD with 10ns propagation delay, suitable for industrial applications. Featuring 22 inputs and 10 I/O lines, it offers a max clock frequency of 90MHz and includes 132 product terms for versatile programming options. With a rectangular package shape and through-hole terminals, this flash PLD is ideal for PAL-type architecture designs requiring fast processing speeds.
LC4128ZC-75TN100E
LC4128ZC-75TN100E by Lattice Semiconductor is a 128 macrocell EE PLD with 7.5 ns propagation delay, 74 inputs, and 64 I/O lines. Ideal for applications requiring in-system programmability, it features a max clock frequency of 111 MHz and operates b/w -40 to 130 °C.
XC2C64A-5VQ44C
XC2C64A-5VQ44C by Xilinx is a 64 macrocell FLASH PLD with 33 I/O lines, operating at up to 333 MHz. It features a propagation delay of 5 ns and can be in-system programmable. Ideal for applications requiring high-speed processing and versatile I/O capabilities in commercial-grade environments.
EPF10K20TC144-4N
Intel's EPF10K20TC144-4N is a PLD with 1152 logic cells, 0.6 ns propagation delay, and 102 inputs. It operates at 5V, has a max temp of 70°C, and uses CMOS technology. Ideal for applications requiring fast processing speeds and high input/output capabilities in commercial-grade environments.
GAL16V8D-25LJNI
GAL16V8D-25LJNI by Lattice Semiconductor is a PLD with 25ns propagation delay, 5.5V max supply voltage, and 37MHz clock frequency. Ideal for industrial applications requiring EE PLDs with 64 product terms, 8 dedicated inputs/outputs, and macrocell output function in a square chip carrier package.
EPM7128STI100-10N
EPM7128STI100-10N by Intel is a 128 macrocell EE PLD with 10 ns propagation delay and 125 MHz max clock frequency. It is used in industrial applications, featuring in-system programmability, JTAG boundary scan test, and 84 I/O lines for versatile connectivity.
M4A5-64/32-10JNC
M4A5-64/32-10JNC by Lattice Semiconductor is a 64 macrocell EE PLD with 32 I/O lines, operating at up to 62.5 MHz. It features a propagation delay of 10 ns and can be in-system programmable. Ideal for applications requiring fast processing speeds and versatile I/O configurations in commercial-grade environments.
SLG47004V
Renesas Electronics
SLG47004V by Renesas Electronics is a 20 macrocell OT PLD with 8 inputs and 7 I/O lines. Operating at 2.4-5.5 V, it's in-system programmable and has a max temp of 85°C. Ideal for applications requiring a compact, low-profile programmable logic device with versatile input/output functions.
XC9572XL-7VQ64I
The Xilinx XC9572XL-7VQ64I is a 3.3V FLASH PLD with 72 macro cells, 36 inputs/outputs, and a clock frequency of 125MHz. Ideal for industrial applications, it offers in-system programmability, JTAG boundary scan test support, and operates b/w -40 to 85°C.
5M80ZE64C4N
Intel's 5M80ZE64C4N is a FLASH PLD with 64 macro cells, 7.9 ns propagation delay, and 184.1 MHz max clock frequency. Ideal for applications requiring in-system programmability, such as high-speed digital designs or embedded systems development.
EPF10K50RC240-3N
EPF10K50RC240-3N by Intel is a PLD with 2880 logic cells, 0.6 ns propagation delay, and 66.67 MHz max clock frequency. Ideal for applications requiring high-speed data processing and complex logic operations in commercial-grade environments.
EPM3512AQC208-10N
EE PLD; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
5M2210ZF256C5N
Intel's 5M2210ZF256C5N is a PLD with 1700 macro cells, 203 inputs/outputs, and 201.1 MHz clock frequency. Ideal for applications requiring fast propagation delay of 11.2 ns, such as high-speed digital designs or signal processing systems. Features include in-system programmability and JTAG boundary scan testing for efficient development and debugging processes.
5M2210ZF256I5N
Intel's 5M2210ZF256I5N is a FLASH PLD with 1700 macro cells, 203 I/O lines, and 201.1 MHz clock frequency. Ideal for industrial applications requiring in-system programmability and JTAG boundary scan testing capabilities.
5M2210ZF256C4N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
5M2210ZF324C5N
FLASH PLD; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE;
5M2210ZF324C4N
Intel's 5M2210ZF324C4N is a FLASH PLD with 1700 macro cells, 271 I/O lines, and 247.5 MHz clock frequency. Ideal for applications requiring fast propagation delay of 9.1 ns, such as high-speed digital systems and communication devices. Its CMOS technology and in-system programmability make it versatile for various design needs.
5M2210ZF256I5
Intel's 5M2210ZF256I5 is a FLASH PLD with 1700 macro cells, 203 I/O lines, and max clock frequency of 201.1 MHz. Ideal for industrial applications requiring high-speed data processing and low power consumption. Features JTAG boundary scan test for efficient debugging and in-system programmability for flexibility.
5M2210ZF256C5
5M2210ZF324I5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LBGA; Package Shape: SQUARE;
5M2210ZF324C4
5M2210ZF324A5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
5M2210ZF256A5N
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
5M2210ZF324I5
5M2210ZF324C5
5M2210ZF256C4
FLASH PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
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