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IS61WV25616BLL-10TL

Integrated Silicon Solution

IS61WV25616BLL-10TL by Integrated Silicon Solution

STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Technology: CMOS;

Median Price

$3.190

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,297 parts In-Stock

1+ parts

$3.350

100+ parts

$2.963

1k+ parts

$2.725

10k+ parts

$2.657

1,297

$3.350

$2.963

$2.725

$2.657

Mouser Electronics

USA . 1,183 parts In-Stock

1+ parts

$3.350

100+ parts

$2.860

1k+ parts

$2.660

10k+ parts

-

1,183

$3.350

$2.860

$2.660

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Verical

USA . 82 parts In-Stock

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-

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$3.190

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82

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Arrow

USA . 82 parts In-Stock

1+ parts

-

100+ parts

$2.839

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$2.537

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82

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$2.839

$2.537

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Chip1Stop

Japan . 82 parts In-Stock

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$2.815

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82

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$2.815

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DF Sales Co.

USA . 72 parts In-Stock

1+ parts

$2.800

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$2.800

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DF Sales Co.

USA . 72 parts In-Stock

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$2.800

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72

$2.800

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Velocity Electronics

USA . 1,350 parts In-Stock

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1,350

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Prism Electronics

USA . 194 parts In-Stock

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LWI Electronics Inc

India . 55 parts In-Stock

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55

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EMSNET

USA . 35 parts In-Stock

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Sensible Micro Corp

USA . 11 parts In-Stock

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PC Components Company LLC

USA . 6 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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M&R Communications

USA . 5 parts In-Stock

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Distributors (Availability)

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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QUARKTWIN TECHNOLOGY LTD

USA . 5,497 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,843 parts In-Stock

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1,843

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Metaverse IC Inc.

Canada . 150 parts In-Stock

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150

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Technical Specifications

SRAM IS61WV25616BLL-10TL attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

IS61WV25616BLL-10TL Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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