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IS31FL3731C-SALS2

Integrated Silicon Solution

IS31FL3731C-SALS2 by Integrated Silicon Solution

IS31FL3731C-SALS2 by Integrated Silicon Solution is a DOT MATRIX LED DISPLAY DRIVER with SERIAL data input mode. It operates b/w -40 to 85 °C and supports up to 144 segments. Ideal for industrial applications requiring small outline, surface mount package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 236 parts In-Stock

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236

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Nova Conductors

Japan . 87 parts In-Stock

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87

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Distributors (Availability)

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AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$9.336

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747

$9.336

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$16.306

100+ parts

$14.838

1k+ parts

$13.371

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5,000

$16.306

$14.838

$13.371

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Component Stockers USA

USA . 6,236 parts In-Stock

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$16.960

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6,236

$16.960

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Continental Prestige Electronics

USA . 5,226 parts In-Stock

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Argo Parts USA

USA . 2,399 parts In-Stock

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2,399

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Unlock endless possibilities with the IS31FL3731C-SALS2 by Integrated Silicon Solution. This innovative LED display driver boasts top-notch quality and reliability, making it a go-to choice for various applications in the graphics display drivers category. With its sleek design and versatile features, this product offers unparalleled value and benefits to customers seeking high-performance solutions. Elevate your projects to new heights with the IS31FL3731C-SALS2 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the package lightweight and durable, ideal for portable devices.

Display Mode: DOT MATRIX

Dot matrix display allows for versatile and customizable graphics and text display options.

Data Input Mode: SERIAL

Serial data input mode allows for easy integration with other digital systems and microcontrollers.

Surface Mount: YES

Surface mount capability makes for easy and compact integration onto circuit boards.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards and maximizes space usage.

No. of Terminals: 28

A higher number of terminals allow for more connections and functionality in the device.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage enables operation in a wide range of power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved connectivity.

Maximum Seated Height: 1.8 mm

Low maximum seated height allows for slim and compact device design.

Width: 5.3 mm

Narrow width enables space-efficient placement on circuit boards.

Length: 10.2 mm

Optimal length for accommodating the required number of terminals and components.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure contacts and easier soldering during assembly.

Nominal Supply Voltage: 3.6 V

Stable nominal supply voltage ensures consistent performance of the device.

No. of Segments: 144

Higher number of segments allows for detailed and complex display output.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density mounting and compact design.

Minimum fmax: 0.4 MHz

Higher minimum fmax frequency ensures fast data processing and display refresh rates.

Interface IC Type: LED DISPLAY DRIVER

LED display driver interface provides efficient control and management of LED displays.

Technical Specifications

Graphics Display Drivers IS31FL3731C-SALS2 attributes and parameters. Explore more Graphics Display Drivers devices from Integrated Silicon Solution

Specs

Data Input Mode:

SERIAL

Display Mode:

DOT MATRIX

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

1

No. of Segments:

144

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

.4 MHz

Trade Compliance

IS31FL3731C-SALS2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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