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IS29GL256-70SLEB

Integrated Silicon Solution

IS29GL256-70SLEB by Integrated Silicon Solution

IS29GL256-70SLEB by Integrated Silicon Solution is a 256M Flash Memory with 268435456-bit memory density. It operates at 70ns access time, suitable for industrial applications. Features include 3V programming voltage and -40 to 105°C operating temperature range, making it ideal for high-performance systems.

Median Price

$6.140

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 24 parts In-Stock

1+ parts

$5.370

100+ parts

$4.610

1k+ parts

$4.490

10k+ parts

-

24

$5.370

$4.610

$4.490

-

DigiKey

USA . 84 parts In-Stock

1+ parts

$6.910

100+ parts

$5.945

1k+ parts

$5.572

10k+ parts

$5.448

84

$6.910

$5.945

$5.572

$5.448

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

QUARKTWIN TECHNOLOGY LTD

USA . 16,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,406

-

-

-

-

Perfect Parts

USA . 3,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,117

-

-

-

-

Overview

Unlock a world of endless possibilities with the IS29GL256-70SLEB by Integrated Silicon Solution. Manufactured with precision and expertise, this Flash Memory device offers reliable performance and durability. Ideal for a wide range of applications, this product provides seamless data storage and retrieval, making it a valuable asset for businesses and individuals alike. Experience the convenience and efficiency that the IS29GL256-70SLEB brings to your projects, enhancing productivity and innovation. Choose quality, choose Integrated Silicon Solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount compatibility allows for easy installation on PCBs, saving space and simplifying assembly.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables efficient data transfer and processing without being tied to a specific clock signal.

Nominal Supply Voltage / Vsup (V): 3

Works efficiently with standard voltage supply of 3V, common in many electronic devices.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall performance of the product.

Memory IC Type: FLASH

Flash memory technology offers fast read/write speeds, high reliability, and non-volatile storage, essential for data retention in electronic devices.

Technical Specifications

Flash Memory IS29GL256-70SLEB attributes and parameters. Explore more Flash Memory devices from Integrated Silicon Solution

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

56

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

14 mm

Trade Compliance

IS29GL256-70SLEB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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