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71V2556S133PFGI

Integrated Device Technology

71V2556S133PFGI by Integrated Device Technology

ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFF; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$12.670

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 72 parts In-Stock

1+ parts

$12.160

100+ parts

$9.640

1k+ parts

$9.070

10k+ parts

-

72

$12.160

$9.640

$9.070

-

Renesas

USA . 72 parts In-Stock

1+ parts

$12.670

100+ parts

$10.158

1k+ parts

-

10k+ parts

-

72

$12.670

$10.158

-

-

DigiKey

USA . 72 parts In-Stock

1+ parts

$14.830

100+ parts

$12.847

1k+ parts

-

10k+ parts

-

72

$14.830

$12.847

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,523 parts In-Stock

1+ parts

$30.347

100+ parts

-

1k+ parts

-

10k+ parts

-

1,523

$30.347

-

-

-

Component Stockers USA

USA . 190 parts In-Stock

1+ parts

$138.590

100+ parts

-

1k+ parts

-

10k+ parts

-

190

$138.590

-

-

-

Northwest PG Solutions

USA . 232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

232

-

-

-

-

Native Components

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Technical Specifications

SRAM 71V2556S133PFGI attributes and parameters. Explore more SRAM devices from Integrated Device Technology

Specs

Maximum Access Time:

4.2 ns

Additional Features:

PIPELINED ARCHITECTURE

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PQFP-F100

JESD-609 Code:

e3

Length:

20 mm

Memory Density:

4718592 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX36

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFF

Package Equivalence Code:

QFP100,.63X.87

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.045 Amp

Minimum Standby Voltage:

3.14 V

Sub-Category:

SRAMs

Maximum Supply Current:

310 mA

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

71V2556S133PFGI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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