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TD330N16KOFHPSA2

Infineon Technologies

TD330N16KOFHPSA2 by Infineon Technologies

TD330N16KOFHPSA2 by Infineon is a 1600V SCR with 200mA DC Gate Trigger Current and 520A RMS On-state Current. Ideal for high-power applications, it features a single configuration with built-in diode and flange mount package style.

Median Price

$198.580

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 80 parts In-Stock

1+ parts

$184.260

100+ parts

$170.200

1k+ parts

-

10k+ parts

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80

$184.260

$170.200

-

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Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$191.000

100+ parts

-

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3

$191.000

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-

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Rochester

USA . 3 parts In-Stock

1+ parts

$198.580

100+ parts

$186.670

1k+ parts

$168.800

10k+ parts

-

3

$198.580

$186.670

$168.800

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Verical

USA . 3 parts In-Stock

1+ parts

$203.000

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3

$203.000

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Newark

USA . 2 parts In-Stock

1+ parts

$245.430

100+ parts

-

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2

$245.430

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Distributors (In-Stock)

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Digiode

USA . 62 parts In-Stock

1+ parts

$162.450

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-

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62

$162.450

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Galco

USA . 6 parts In-Stock

1+ parts

$226.930

100+ parts

-

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6

$226.930

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$236.852

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450

$236.852

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Vyrian

USA . 8,682 parts In-Stock

1+ parts

-

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8,682

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$2.802

100+ parts

$2.662

1k+ parts

$2.662

10k+ parts

-

600

$2.802

$2.662

$2.662

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Corohmni

South Africa . 189 parts In-Stock

1+ parts

$3.248

100+ parts

-

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189

$3.248

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Aztec Data Supply Inc.

USA . 8,165 parts In-Stock

1+ parts

$4.090

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-

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8,165

$4.090

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Modulus Dynamics

Lithuania . 4,255 parts In-Stock

1+ parts

$4.600

100+ parts

$4.416

1k+ parts

$4.232

10k+ parts

-

4,255

$4.600

$4.416

$4.232

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AZTECH Wire

Italy . 525 parts In-Stock

1+ parts

$5.182

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525

$5.182

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Semicontronic

India . 3 parts In-Stock

1+ parts

$138.550

100+ parts

$135.086

1k+ parts

$134.394

10k+ parts

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3

$138.550

$135.086

$134.394

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Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$146.200

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3

$146.200

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Corphita

USA . 107 parts In-Stock

1+ parts

$153.900

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107

$153.900

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Netroflash

USA . 100 parts In-Stock

1+ parts

$236.852

100+ parts

-

1k+ parts

$225.009

10k+ parts

$220.272

100

$236.852

-

$225.009

$220.272

Component Stockers USA

USA . 4 parts In-Stock

1+ parts

$295.080

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4

$295.080

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Microchip USA

USA . 6,161 parts In-Stock

1+ parts

$357.420

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6,161

$357.420

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Argo Parts USA

USA . 2,499 parts In-Stock

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2,499

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Continental Prestige Electronics

USA . 2,469 parts In-Stock

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2,469

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Perfect Parts

USA . 24 parts In-Stock

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24

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Overview

Unleash the power of cutting-edge technology with the TD330N16KOFHPSA2 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch Silicon Controlled Rectifiers that offer unparalleled performance and reliability. From industrial applications to consumer electronics, this SCR is designed to meet your needs with its high-quality construction and advanced features. Experience the value and benefits of Infineon's TD330N16KOFHPSA2, and take your projects to the next level with confidence.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 200 mA

The high gate trigger current allows for reliable and fast switching of the SCR, making it suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and reduces the need for additional components, making it cost-effective and efficient.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various systems or circuits.

Repetitive Peak Reverse Voltage: 1600 V

The high reverse voltage rating ensures the SCR can handle high voltage spikes or surges, providing a reliable and robust performance.

No. of Terminals: 5

The five terminals provide flexibility in connecting the SCR to other components or circuits, allowing for versatile applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy installation and secure mounting, ensuring stability in the application.

Trigger Device Type: SCR

Being an SCR (Silicon Controlled Rectifier), this device offers precise control over power flow, making it ideal for applications requiring efficient and controlled switching.

Terminal Position: UPPER

The upper terminal position makes it convenient for connections and reduces the chances of interference with other components or circuits.

Maximum RMS On-state Current: 520 A

The high on-state current rating allows the SCR to handle large loads or currents, making it suitable for high-power applications.

Case Connection: ISOLATED

The isolated case connection enhances safety by providing insulation from other components or circuits, reducing the risk of electrical accidents.

Repetitive Peak Off-state Voltage: 1600 V

The high off-state voltage rating ensures the SCR can withstand voltage fluctuations or spikes during operation, leading to a stable and reliable performance.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TD330N16KOFHPSA2 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies

Specs

Case Connection:

Maximum DC Gate Trigger Current:

200 mA

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

520 A

Repetitive Peak Off-state Voltage:

1600 V

Repetitive Peak Reverse Voltage:

1600 V

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

TD330N16KOFHPSA2 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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