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V23826-K305-C13

Infineon Technologies

V23826-K305-C13 by Infineon Technologies

TRANSCEIVER; Mounting Feature: THROUGH HOLE MOUNT; Maximum Supply Voltage: 5.25 V; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: 0 Cel; Communication Standard: GBE;

Median Price

$37.725

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 3,390 parts In-Stock

1+ parts

$20.450

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3,390

$20.450

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DF Sales Co.

USA . 3,390 parts In-Stock

1+ parts

$20.450

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3,390

$20.450

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TEDSS.com

USA . 7,797 parts In-Stock

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$55.000

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7,797

$55.000

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American Microsemiconductor Inc.

USA . 9 parts In-Stock

1+ parts

$85.250

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9

$85.250

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R&J Components

USA . 4,637 parts In-Stock

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4,637

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Bristol Electronics

USA . 1,165 parts In-Stock

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Digiode

USA . 851 parts In-Stock

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851

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Vyrian

USA . 261 parts In-Stock

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Prism Electronics

USA . 7 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 843 parts In-Stock

1+ parts

$2.709

100+ parts

$2.601

1k+ parts

$2.492

10k+ parts

-

843

$2.709

$2.601

$2.492

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Andel Nordic

Denmark . 301 parts In-Stock

1+ parts

$24.690

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$17.282

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$17.282

301

$24.690

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$17.282

$17.282

Corphita

USA . 682 parts In-Stock

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Perfect Parts

USA . 344 parts In-Stock

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Technical Specifications

Fiber Optics - Transceivers V23826-K305-C13 attributes and parameters. Explore more Fiber Optics - Transceivers devices from Infineon Technologies

Specs

Additional Features:

IT ALSO HAS WAVELENGTH 770 TO 860 NM AND REFERENCE STD-FCC, FDA

Body Width:

25.25 inch

Body Height:

9.79 mm

Body Length/Diameter:

38.6 mm

Built-in Features:

AMPLIFIER

Communication Standard:

GBE

Connection Type:

SC CONNECTOR

Rx Data Rate:

1300 Mbps

Tx Data Rate:

1300 Mbps

Emitter or Detector Type:

LASER

Fiber Optic Type:

Fiber Type:

50, 62.5, MMF

Mounting Feature:

Maximum Operating Temperature:

Minimum Operating Temperature:

Maximum Operating Wavelength:

860 nm

Minimum Operating Wavelength:

830 nm

Nominal Operating Wavelength:

850 nm

Nominal Optical Power Output:

.211 mW

Minimum Return Loss:

12 dB

Sensitivity Level:

-20 dBm

Sub-Category:

Fiber Optic Transceivers

Maximum Supply Voltage:

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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