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V23079-D2011-B301

Infineon Technologies

V23079-D2011-B301 by Infineon Technologies

RF RELAY; Mounting Feature: SURFACE MOUNT-STRAIGHT; Relay Action: MOMENTARY; Relay Function: DPDT; Coil or Input Supply Type: DC; Reference Standard: CSA; UL;

Median Price

$2.490

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

PEI Genesis

USA . 1,200 parts In-Stock

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1,200

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Verical

USA . 1,200 parts In-Stock

1+ parts

-

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-

1k+ parts

$2.440

10k+ parts

$2.440

1,200

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-

$2.440

$2.440

Chip1Stop

Japan . 1,200 parts In-Stock

1+ parts

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$2.540

10k+ parts

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1,200

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-

$2.540

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 907 parts In-Stock

1+ parts

$2.440

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907

$2.440

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Digiode

USA . 698 parts In-Stock

1+ parts

$4.550

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698

$4.550

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R&J Components

USA . 2,200 parts In-Stock

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2,200

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Rapid Electronics

USA . 1,200 parts In-Stock

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1,200

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IBS Electronics

USA . 1,200 parts In-Stock

1+ parts

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$2.574

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1,200

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$2.574

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Bristol Electronics

USA . 681 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 375 parts In-Stock

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375

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PC Components Company LLC

USA . 266 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,674 parts In-Stock

1+ parts

$3.426

100+ parts

$3.289

1k+ parts

$3.152

10k+ parts

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1,674

$3.426

$3.289

$3.152

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Corphita

USA . 275 parts In-Stock

1+ parts

$4.311

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$4.311

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Perfect Parts

USA . 4,290 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,415 parts In-Stock

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2,415

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Assy Fe

Spain . 1,600 parts In-Stock

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Glotronic Ltd.

UK . 400 parts In-Stock

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400

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Technical Specifications

Radio Frequency Relays V23079-D2011-B301 attributes and parameters. Explore more Radio Frequency Relays devices from Infineon Technologies

Relay Specifications

Relay Type:

Relay Function:

Relay Action:

Relay Form:

2 Form C

Physical Characteristics

Height:

0.39 in (9.9 mm)

Length/Diameter:

0.575 in (14.6 mm)

Dimensions:

0.591 x 0.295 x 0.39 in (15 x 7.5 x 9.9 mm)

Width:

7.2 in (182.88 mm)

No. of Terminals:

10

Weight:

2.8 g

PCB Hole Count:

10

Mounting Type:

Packing Method:

Tape and Reel

Operational Characteristics

Activation Time:

8 ms

Release Time:

9 ms

Insulation Resistance:

1000 GΩ

Maximum Insertion Loss:

-0.27 dB

Minimum Operating Frequency:

100 MHz

Maximum Operating Frequency:

900 MHz

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Switching Method:

Random

Transition Time:

17 ms

Maximum Isolation:

-20.7 dB

Voltage Standing Wave Ratio:

1.4

Coil-Contacts Dielectric Strength:

1.5 kVrms

Coil Electrical Specifications

Coil Resistance:

145 Ω

Coil Maximum DC Voltage:

4.5 V

Coil Power:

300 mW

Coil Maximum DC Current:

31 mA

Coil DC Operate Voltage:

3.375 V

Coil DC Release Voltage:

450 mV

Coil Nominal Voltage:

4.5 V

Contact Electrical Specifications

Contact Maximum DC Current:

2 A

Contact Maximum DC Voltage:

220 V

Contact Maximum DC Rating (R Load):

2A@220VDC

Contact Maximum AC Current:

2 A

Contact Maximum AC Voltage:

250 V

Contact Maximum AC Rating (R Load):

2A@250VAC

Contact Resistance:

50 mΩ

Open Contacts Dielectric Strength:

1 kVrms

Contact Maximum DC Power Rating (R Load):

60W@220VDC

Contact Maximum AC Power Rating (R Load):

62.5VA@250VAC

Terminal & Contact Material

Termination Type:

Solder/Quick Connect

Contact End Material:

Silver Nickel

Contact End Plating:

Gold

Reliability & Standards

Industry Standard Compliance:

Lifespan:

200000 Cycle(s)

Sealing Type:

IP67

Trade Compliance

V23079-D2011-B301 Relays trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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