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TLE4226G

Infineon Technologies

TLE4226G by Infineon Technologies

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$1.585

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,430 parts In-Stock

1+ parts

-

100+ parts

$1.370

1k+ parts

$1.220

10k+ parts

$1.150

1,430

-

$1.370

$1.220

$1.150

DigiKey

USA . 1,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.800

10k+ parts

-

1,430

-

-

$1.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 651 parts In-Stock

1+ parts

$1.454

100+ parts

-

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-

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651

$1.454

-

-

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Vyrian

USA . 680 parts In-Stock

1+ parts

$1.530

100+ parts

-

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680

$1.530

-

-

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Corel Iberica Componentes, S.L.

Spain . 1,800 parts In-Stock

1+ parts

-

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1,800

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Q Components

USA . 1,710 parts In-Stock

1+ parts

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1,710

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Classic Components Corporation

USA . 790 parts In-Stock

1+ parts

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790

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Bristol Electronics

USA . 692 parts In-Stock

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R&J Components

USA . 433 parts In-Stock

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433

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ACDS - Activité Composants Distribution Service

France . 250 parts In-Stock

1+ parts

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250

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Ack Elektronik San.Tic.Ltd.Sti

. 250 parts In-Stock

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250

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ComSIT Distribution GmbH

Germany . 180 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,463 parts In-Stock

1+ parts

$1.368

100+ parts

$1.313

1k+ parts

$1.259

10k+ parts

-

4,463

$1.368

$1.313

$1.259

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Corphita

USA . 187 parts In-Stock

1+ parts

$1.377

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187

$1.377

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Component Stockers USA

USA . 1,514 parts In-Stock

1+ parts

$1.570

100+ parts

$1.480

1k+ parts

$1.330

10k+ parts

-

1,514

$1.570

$1.480

$1.330

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Benley Electronics

USA . 1 parts In-Stock

1+ parts

$5.000

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1

$5.000

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Andel Nordic

Denmark . 197 parts In-Stock

1+ parts

$37.220

100+ parts

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$26.052

10k+ parts

$26.052

197

$37.220

-

$26.052

$26.052

Kepictronics

USA . 15,320 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,243 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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RC Electronics

USA . 2,700 parts In-Stock

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$1.440

1k+ parts

$1.350

10k+ parts

$1.330

2,700

-

$1.440

$1.350

$1.330

A-Z Elektronik GmbH

Germany . 1,785 parts In-Stock

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Assy Fe

Spain . 1,018 parts In-Stock

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Perfect Parts

USA . 1,014 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 905 parts In-Stock

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905

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Glotronic Ltd.

UK . 724 parts In-Stock

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724

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GreenTree Electronics

Israel . 390 parts In-Stock

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390

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Technical Specifications

Peripheral Drivers TLE4226G attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

6

JESD-30 Code:

R-PDSO-G24

Length:

15.6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

220

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

3.5 us

Turn-on Time:

1.6 us

Width:

7.6 mm

Trade Compliance

TLE4226G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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