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TDA6170X

Infineon Technologies

TDA6170X by Infineon Technologies

TDA6170X by Infineon Technologies is a small outline audio demodulator IC with 28 terminals. It operates on power supplies of 5-8V and has a harmonic distortion of 0.5%. Ideal for FM demodulation applications, it offers a nominal signal-to-noise ratio of 75dB and output voltage of 500mV.

Median Price

$1.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 47 parts In-Stock

1+ parts

-

100+ parts

$1.750

1k+ parts

$1.560

10k+ parts

$1.470

47

-

$1.750

$1.560

$1.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 49 parts In-Stock

1+ parts

$1.730

100+ parts

-

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49

$1.730

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Digiode

USA . 615 parts In-Stock

1+ parts

$1.843

100+ parts

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615

$1.843

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Ack Elektronik San.Tic.Ltd.Sti

. 90 parts In-Stock

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90

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Vyrian

USA . 47 parts In-Stock

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47

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,407 parts In-Stock

1+ parts

$0.645

100+ parts

-

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-

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2,407

$0.645

-

-

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Continental Prestige Electronics

USA . 2,946 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

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10k+ parts

$1.695

2,946

$1.730

-

-

$1.695

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.730

100+ parts

-

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1,000

$1.730

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Argo Parts USA

USA . 672 parts In-Stock

1+ parts

$1.730

100+ parts

-

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672

$1.730

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Corphita

USA . 901 parts In-Stock

1+ parts

$1.746

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901

$1.746

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Ampacity Inc.

Singapore . 47 parts In-Stock

1+ parts

$3.590

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47

$3.590

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Modulus Dynamics

Lithuania . 4,083 parts In-Stock

1+ parts

$3.853

100+ parts

$3.699

1k+ parts

$3.545

10k+ parts

-

4,083

$3.853

$3.699

$3.545

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Microchip USA

USA . 1,680 parts In-Stock

1+ parts

$12.090

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1,680

$12.090

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AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$17.904

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558

$17.904

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Andel Nordic

Denmark . 3,902 parts In-Stock

1+ parts

$28.520

100+ parts

-

1k+ parts

$19.965

10k+ parts

$19.965

3,902

$28.520

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$19.965

$19.965

A-Z Elektronik GmbH

Germany . 5,472 parts In-Stock

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Perfect Parts

USA . 5,019 parts In-Stock

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5,019

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 106 parts In-Stock

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106

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Assy Fe

Spain . 6 parts In-Stock

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6

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Overview

Experience crystal-clear sound quality and seamless demodulation with the TDA6170X by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch performance and reliability in all their products. The TDA6170X falls under the category of Receiver ICs, making it perfect for applications in audio systems. With a low harmonic distortion of only 0.5% and a nominal signal-to-noise ratio of 75dB, this product guarantees an exceptional listening experience. Whether you're a music enthusiast or an audio professional, the TDA6170X offers unmatched value, benefits, and advantages that will elevate your audio experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated into circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the PCB, maximizing space utilization.

General IC Type: AUDIO DEMODULATOR

This audio demodulator IC ensures clear and high-quality audio output, making it suitable for audio applications.

Harmonic Distortion: 0.5%

With low harmonic distortion, this IC delivers accurate signal reproduction, resulting in high-fidelity audio output.

Power Supplies (V): 5,8

This IC is compatible with power supplies ranging from 5V to 8V, offering flexibility in power source selection.

No. of Terminals: 28

The 28 terminals provide ample connection options, allowing for versatile and customized circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this IC can withstand heat and perform reliably in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that this IC can function in a wide range of temperature conditions.

Technical Specifications

Receiver ICs TDA6170X attributes and parameters. Explore more Receiver ICs devices from Infineon Technologies

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.5 %

JESD-30 Code:

R-PDSO-G28

Length:

18.1 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Voltage (FM):

500 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,8

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

75 dB

Sub-Category:

Receiver ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

7.2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.6 mm

Trade Compliance

TDA6170X General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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