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TDA4916GGHUMA1

Infineon Technologies

TDA4916GGHUMA1 by Infineon Technologies

TDA4916GGHUMA1 by Infineon is a 24-terminal switching controller with voltage-mode control, operating b/w -40 to 85°C. With a max input voltage of 15V and switching frequency of 400 kHz, it's ideal for industrial applications requiring small outline packages in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,410 parts In-Stock

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3,410

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Digiode

USA . 881 parts In-Stock

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881

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Nova Conductors

Japan . 74 parts In-Stock

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74

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Distributors (Availability)

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Ampacity Inc.

Singapore . 633 parts In-Stock

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$2.500

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633

$2.500

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Semicontronic

India . 631 parts In-Stock

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$7.500

100+ parts

$7.312

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$7.275

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631

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 570 parts In-Stock

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$7.522

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570

$7.522

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Modulus Dynamics

Lithuania . 2,175 parts In-Stock

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$15.762

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$15.132

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$14.501

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2,175

$15.762

$15.132

$14.501

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Aztec Data Supply Inc.

USA . 97 parts In-Stock

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$20.199

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97

$20.199

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Corohmni

South Africa . 53 parts In-Stock

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$20.684

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53

$20.684

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Continental Prestige Electronics

USA . 6,707 parts In-Stock

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6,707

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Argo Parts USA

USA . 4,959 parts In-Stock

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Corphita

USA . 951 parts In-Stock

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951

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Microchip USA

USA . 152 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Unlock the power of efficient energy management with the TDA4916GGHUMA1 by Infineon Technologies. As a leading manufacturer in the field of Switching Regulators & Controllers, Infineon delivers top-quality products that guarantee reliability and performance. This versatile device is ideal for a wide range of applications, from industrial to automotive. With its compact design and advanced features like voltage-mode control, the TDA4916GGHUMA1 offers customers unbeatable value, increased efficiency, and seamless integration into their systems. Trust Infineon to provide the solutions you need for a smarter, more sustainable future.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

With surface mount capability, this product is easy to integrate onto PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space, making it suitable for compact designs.

No. of Terminals: 24

With 24 terminals, this product offers flexibility in connectivity options, making it versatile for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in reducing board space requirements, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product can withstand harsh operating conditions, ensuring reliability in the long run.

Technical Specifications

Switching Regulators & Controllers TDA4916GGHUMA1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Infineon Technologies

Specs

Additional Features:

CAN BE OPERATED IN CURRENT MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

15 V

Minimum Input Voltage:

0 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G24

Length:

15.6 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

400 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.6 mm

Trade Compliance

TDA4916GGHUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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