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TDA4862XKLA1

Infineon Technologies

TDA4862XKLA1 by Infineon Technologies

TDA4862XKLA1 by Infineon is a current-mode power factor controller with 8 terminals in an inline package. It operates on 9.2-15V input voltage, delivering up to 0.5A output current using pulse width modulation control technique. Ideal for switching regulators, it offers compact dimensions of 10x7.62x4.2mm for efficient power management applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,057 parts In-Stock

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Digiode

USA . 584 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 372 parts In-Stock

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$0.500

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Corohmni

South Africa . 1,153 parts In-Stock

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$10.119

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AZTECH Wire

Italy . 355 parts In-Stock

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Modulus Dynamics

Lithuania . 3,353 parts In-Stock

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$23.162

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$22.236

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$21.309

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Continental Prestige Electronics

USA . 6,561 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 576 parts In-Stock

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Argo Parts USA

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Microchip USA

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Overview

Enhance the performance of your electronic devices with the TDA4862XKLA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in all its products. The TDA4862XKLA1 falls under the category of Switching Regulators & Controllers, offering versatile applications and efficient power management. With its compact design and advanced control mode, this power factor controller provides customers with unparalleled value, benefits, and advantages. Upgrade your electronics with the TDA4862XKLA1 today for enhanced functionality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the switching regulator, ensuring a longer lifespan.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices or systems.

No. of Terminals: 8

Having 8 terminals allows for a more versatile and customizable connection setup, accommodating a wider range of applications.

Control Mode: CURRENT-MODE

Current-mode control offers improved stability and control over output current, making the regulator more efficient and reliable.

Maximum Seated Height: 4.2 mm

The low seated height makes the regulator suitable for compact and space-constrained designs.

Nominal Input Voltage: 12 V

With a nominal input voltage of 12V, this regulator is compatible with standard power sources, making it easy to integrate into existing systems.

Maximum Output Current: 0.5 A

The maximum output current of 0.5A ensures sufficient power delivery for various applications without risking overheating or damage.

Control Technique: PULSE WIDTH MODULATION

PWM control technique offers precise regulation of the output voltage, resulting in stable and efficient power conversion.

Technical Specifications

Switching Regulators & Controllers TDA4862XKLA1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Infineon Technologies

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

15 V

Minimum Input Voltage:

9.2 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDIP-T8

Length:

10 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Surface Mount:

NO

Switcher Config:

SINGLE

Technology:

BIPOLAR

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

TDA4862XKLA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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