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TD240N18SOFHPSA1

Infineon Technologies

TD240N18SOFHPSA1 by Infineon Technologies

Infineon's TD240N18SOFHPSA1 is a 240A SCR with 1.52V max on-state voltage, 145mA DC gate trigger current, and 5200A non-repetitive peak on-state current. Ideal for applications requiring high power switching like industrial motor drives or power supplies.

Median Price

$55.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$55.000

100+ parts

-

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9

$55.000

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DigiKey

USA . 26 parts In-Stock

1+ parts

$55.140

100+ parts

$40.212

1k+ parts

-

10k+ parts

-

26

$55.140

$40.212

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 955 parts In-Stock

1+ parts

$51.889

100+ parts

-

1k+ parts

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955

$51.889

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$54.689

100+ parts

-

1k+ parts

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10

$54.689

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Vyrian

USA . 8,095 parts In-Stock

1+ parts

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8,095

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,607 parts In-Stock

1+ parts

$2.512

100+ parts

$2.412

1k+ parts

$2.311

10k+ parts

-

1,607

$2.512

$2.412

$2.311

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AZTECH Wire

Italy . 629 parts In-Stock

1+ parts

$12.289

100+ parts

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629

$12.289

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Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$46.870

100+ parts

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12

$46.870

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Corphita

USA . 939 parts In-Stock

1+ parts

$49.158

100+ parts

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939

$49.158

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Continental Prestige Electronics

USA . 1,083 parts In-Stock

1+ parts

$54.689

100+ parts

-

1k+ parts

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10k+ parts

$53.595

1,083

$54.689

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$53.595

Netroflash

USA . 500 parts In-Stock

1+ parts

$54.689

100+ parts

$53.595

1k+ parts

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500

$54.689

$53.595

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Microchip USA

USA . 6,953 parts In-Stock

1+ parts

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6,953

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Argo Parts USA

USA . 3,875 parts In-Stock

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3,875

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Perfect Parts

USA . 36 parts In-Stock

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36

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Overview

Experience the superior quality and reliability of the TD240N18SOFHPSA1 by Infineon Technologies, a leading manufacturer in the industry. This silicon-controlled rectifier (SCR) offers unparalleled performance and efficiency, making it ideal for a wide range of applications. From industrial equipment to power supplies, this product provides exceptional value with its high on-state current, low leakage current, and quick connect terminals. Trust in the excellence of Infineon Technologies and elevate your projects to new heights with the TD240N18SOFHPSA1.

Feature Benefit Bullets

Maximum On-state Voltage: 1.52 V

Low on-state voltage helps in reducing power losses and improving efficiency of the product.

Maximum DC Gate Trigger Current: 145 mA

High gate trigger current ensures reliable and consistent switching of the SCR.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies the circuit design and offers added protection against reverse current.

Non Repetitive Peak On-state Current: 5200 A

High peak current capability allows the SCR to handle large transient loads effectively.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to mount and install the SCR in various applications.

Maximum On-state Current: 240 A

High on-state current rating allows the SCR to handle heavy loads without overheating.

Quick Connects Description: G-GR

Quick connect terminals simplify the installation process and save time.

Maximum Leakage Current: 30 mA

Low leakage current ensures minimal power consumption when the SCR is in the off-state.

Repetitive Peak Reverse Voltage: 1800 V

High reverse voltage rating provides protection against voltage spikes and surges.

No. of Terminals: 5

Having 5 terminals allows for versatile connection options in the circuit.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides stability and secure mounting in industrial applications.

Maximum Operating Temperature: 140 °C

High operating temperature range allows the SCR to function reliably in challenging environments.

Trigger Device Type: SCR

Being a Silicon Controlled Rectifier (SCR), it offers precise control over power delivery in the circuit.

Terminal Position: UPPER

Upper terminal position facilitates easy connection and wiring in tight spaces.

Maximum RMS On-state Current: 275 A

High RMS current rating enables the SCR to handle continuous loads effectively.

Maximum DC Gate Trigger Voltage: 2.5 V

Low gate trigger voltage ensures efficient switching of the SCR with minimal power consumption.

Case Connection: ISOLATED

Isolated case connection provides added safety and protection against electrical shocks.

Repetitive Peak Off-state Voltage: 1800 V

High off-state voltage rating ensures reliable isolation in the circuit when the SCR is in the off-state.

Minimum Critical Rate of Rise of Off-state Voltage: 1000 V/us

High rate of rise capability ensures fast and efficient turn-off of the SCR in high-speed applications.

Maximum Holding Current: 200 mA

High holding current ensures that the SCR remains in the on-state even in the presence of low currents.

Screw Terminals Description: A-K-AK

Screw terminals provide a secure and reliable connection in the circuit.

Nominal Circuit Commutated Turn-off Time: 370 us

Fast turn-off time enhances the efficiency and performance of the SCR in dynamic applications.

Reference Standard: IEC-61140, IEC-747-6, UL RECOGNIZED

Compliance with international standards ensures the quality and reliability of the product.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TD240N18SOFHPSA1 attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from Infineon Technologies

Specs

Case Connection:

Nominal Circuit Commutated Turn-off Time:

370 us

Minimum Critical Rate of Rise of Off-state Voltage:

1000 V/us

Maximum DC Gate Trigger Current:

145 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Quick Connects Description:

G-GR

Screw Terminals Description:

A-K-AK

Maximum Holding Current:

200 mA

JESD-30 Code:

R-XUFM-X5

Maximum Leakage Current:

30 mA

Non Repetitive Peak On-state Current:

5200 A

No. of Elements:

1

No. of Terminals:

5

Maximum On-state Voltage:

1.52 V

Maximum On-state Current:

240 A

Maximum Operating Temperature:

140 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

275 A

Reference Standard:

IEC-61140, IEC-747-6, UL RECOGNIZED

Repetitive Peak Off-state Voltage:

1800 V

Repetitive Peak Reverse Voltage:

1800 V

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

TD240N18SOFHPSA1 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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