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TC222L16F133NACKXUMA1

Infineon Technologies

TC222L16F133NACKXUMA1 by Infineon Technologies

Infineon's TC222L16F133NACKXUMA1 is a 32-bit microcontroller with 80 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features ADC and DMA channels, flash ROM programmability, and operates in temperatures ranging from -40°C to 125°C.

Median Price

$16.520

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,790 parts In-Stock

1+ parts

$16.520

100+ parts

$11.179

1k+ parts

$10.444

10k+ parts

-

1,790

$16.520

$11.179

$10.444

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EBV Elektronik

Germany . 90,000 parts In-Stock

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-

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90,000

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$33.075

100+ parts

-

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-

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100

$33.075

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Maritex

Poland . 18,000 parts In-Stock

1+ parts

$79.613

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18,000

$79.613

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NAC Semi

USA . 77,400 parts In-Stock

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$17.880

77,400

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$17.880

Chip Stock

USA . 9,760 parts In-Stock

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9,760

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TME

Poland . 9,000 parts In-Stock

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$11.995

9,000

-

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$11.995

Vyrian

USA . 8,154 parts In-Stock

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8,154

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Rutronik

Germany . 5,400 parts In-Stock

1+ parts

-

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$9.010

5,400

-

-

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$9.010

Digiode

USA . 639 parts In-Stock

1+ parts

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639

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Distributors (Availability)

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AZTECH Wire

Italy . 211 parts In-Stock

1+ parts

$7.821

100+ parts

-

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211

$7.821

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Semicontronic

India . 836 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

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836

$14.000

$13.650

$13.580

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Ampacity Inc.

Singapore . 435 parts In-Stock

1+ parts

$20.000

100+ parts

-

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435

$20.000

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$29.152

100+ parts

$29.152

1k+ parts

$29.152

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500

$29.152

$29.152

$29.152

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Continental Prestige Electronics

USA . 6,766 parts In-Stock

1+ parts

$32.053

100+ parts

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10k+ parts

$31.412

6,766

$32.053

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-

$31.412

Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$33.080

100+ parts

$31.426

1k+ parts

-

10k+ parts

$29.441

800

$33.080

$31.426

-

$29.441

Aztec Data Supply Inc.

USA . 2,799 parts In-Stock

1+ parts

$52.100

100+ parts

-

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2,799

$52.100

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Microchip USA

USA . 2,665 parts In-Stock

1+ parts

$60.858

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2,665

$60.858

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Modulus Dynamics

Lithuania . 2,533 parts In-Stock

1+ parts

$63.668

100+ parts

$61.121

1k+ parts

$58.575

10k+ parts

-

2,533

$63.668

$61.121

$58.575

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Corohmni

South Africa . 130 parts In-Stock

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$80.606

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130

$80.606

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Component Stockers USA

USA . 239 parts In-Stock

1+ parts

$197.020

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239

$197.020

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GreenTree Electronics

Israel . 54,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 5,008 parts In-Stock

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5,008

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Argo Parts USA

USA . 4,744 parts In-Stock

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4,744

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iodParts Technologies Inc.

India . 3,600 parts In-Stock

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Lixinc

USA . 3,296 parts In-Stock

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3,296

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Corphita

USA . 979 parts In-Stock

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979

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Robosynatics

Brazil . 150 parts In-Stock

1+ parts

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$7.370

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$7.370

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$7.370

150

-

$7.370

$7.370

$7.370

Lucentia Tech

USA . 150 parts In-Stock

1+ parts

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100+ parts

$7.370

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$7.370

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$7.370

150

-

$7.370

$7.370

$7.370

Overview

Unleash the power of innovation with the TC222L16F133NACKXUMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality microcontrollers that cater to a wide range of applications. With a maximum clock frequency of 40 MHz and a ROM programmability of FLASH, this product offers unparalleled performance and flexibility. Whether you're working on automotive projects or other cutting-edge technologies, this microcontroller is designed to exceed your expectations. Upgrade your designs today with the TC222L16F133NACKXUMA1 and experience the difference Infineon brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 1.43 V

Can handle higher voltages, providing flexibility in power supply options.

Package Shape: SQUARE

Uniform shape for easy mounting and handling.

Bit Size: 32

Higher bit size allows for more complex operations and calculations.

No. of Terminals: 80

Sufficient terminals for connecting various external components and peripherals.

Minimum Supply Voltage: 1.17 V

Can operate at lower voltages, providing energy efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and automotive applications.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for controlling various functions and devices in embedded systems.

Technology: CMOS

Low power consumption and high noise immunity, ideal for battery-powered devices.

Technical Specifications

Microcontrollers TC222L16F133NACKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

59

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

133 rpm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.17 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM SILVER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TC222L16F133NACKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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