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SIOV-CU3225K275G2

Infineon Technologies

SIOV-CU3225K275G2 by Infineon Technologies

Infineon's SIOV-CU3225K275G2 is a VARISTOR with METAL OXIDE FILM tech. It offers 8.6J energy absorption, 275V RMS & 350V DC max circuit voltage. Ideal for SURFACE MOUNT applications requiring high transient surge protection.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,010 parts In-Stock

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Digiode

USA . 687 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Modulus Dynamics

Lithuania . 58,994 parts In-Stock

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$0.339

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$0.325

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$0.312

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AZTECH Wire

Italy . 802 parts In-Stock

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$6.737

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Argo Parts USA

USA . 3,646 parts In-Stock

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Corphita

USA . 438 parts In-Stock

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Continental Prestige Electronics

USA . 101 parts In-Stock

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Aranea Global

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Overview

Discover the ultimate protection for your electronic devices with the SIOV-CU3225K275G2 by Infineon Technologies. As a leading manufacturer in the industry, Infineon's non-linear resistors provide unmatched quality and reliability. This varistor offers maximum energy absorbing capacity of 8.6 J, ensuring your equipment stays safe from power surges. Ideal for a wide range of applications, this surface mount varistor has a maximum circuit RMS voltage of 275 V and operating voltage of 350 V. Trust Infineon to keep your devices secure and functioning at their best.

Feature Benefit Bullets

Technology: METAL OXIDE FILM

Metal oxide film technology provides high energy absorption capacity, making this product suitable for applications where protection against voltage surges is critical.

Maximum Energy Absorbing Capacity: 8.6 J

The high energy absorbing capacity of 8.6 J ensures effective protection against transient voltage spikes, making this varistor a reliable choice for safeguarding electronic circuits.

Package Style (Meter): DO-214var

The DO-214var package style offers easy installation and replacement, making it convenient for use in various electronic devices and circuits.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and conductivity, ensuring reliable connections for effective circuit protection.

Resistor Type: VARISTOR

Being a varistor, this product can quickly respond to voltage fluctuations and divert excess current away from sensitive components, safeguarding them from damage.

Maximum Circuit RMS Voltage: 275 V

With a maximum circuit RMS voltage of 275 V, this varistor can effectively protect circuits operating within this voltage range from transient voltage spikes.

Operating Voltage: 350 V

The operating voltage of 350 V ensures that this varistor can reliably protect electronic circuits with voltages up to 350 V, providing a wide range of applications.

Mounting Type: SURFACE MOUNT

The surface mounting type enables easy and secure installation onto circuit boards, saving space and making it suitable for compact electronic devices.

Maximum Circuit DC Voltage: 350 V

With a maximum circuit DC voltage of 350 V, this varistor can effectively protect against continuous overvoltage conditions, ensuring the longevity of electronic circuits.

Technical Specifications

Non-linear Resistors SIOV-CU3225K275G2 attributes and parameters. Explore more Non-linear Resistors devices from Infineon Technologies

Specs

Maximum Circuit DC Voltage:

350 V

Maximum Circuit RMS Voltage:

275 V

Maximum Energy Absorbing Capacity:

8.6 J

JESD-609 Code:

e0

Mounting Type:

Package Style (Meter):

DO-214var

Resistor Type:

Sub-Category:

Non-linear Resistors

Technology:

METAL OXIDE FILM

Terminal Finish:

Tin/Lead (Sn/Pb)

Operating Voltage:

350 V

Trade Compliance

SIOV-CU3225K275G2 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.40.40.00

SB

8533.40.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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