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SFH3201

Infineon Technologies

SFH3201 by Infineon Technologies

Infineon's SFH3201 phototransistor operates in -55 to 100°C range with peak wavelength of 860nm. It has max power dissipation of 0.165W and response time of 0.000005s. Ideal for surface mount applications, it can handle max on-state current of 0.015A.

Median Price

$0.703

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Farnell

UK . 1,000 parts In-Stock

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$0.481

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$0.361

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Element14

Singapore . 1,000 parts In-Stock

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$0.925

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$0.749

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$0.749

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Nova Conductors

Japan . 500 parts In-Stock

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$0.589

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$0.589

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Digiode

USA . 604 parts In-Stock

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$1.244

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ComSIT Distribution GmbH

Germany . 57,335 parts In-Stock

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ComSIT USA

USA . 57,000 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 2,000 parts In-Stock

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Rutronik

Germany . 1,000 parts In-Stock

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$0.527

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$0.479

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LIBRA Elektronik GmbH

Germany . 1,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 994 parts In-Stock

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Bristol Electronics

USA . 994 parts In-Stock

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Dan-Mar Components

USA . 994 parts In-Stock

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Cyclops Electronics Ltd

UK . 891 parts In-Stock

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EMSNET

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Vyrian

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Continental Prestige Electronics

USA . 934 parts In-Stock

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$0.252

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Modulus Dynamics

Lithuania . 1,224 parts In-Stock

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$0.498

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$0.478

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$0.458

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Aranea Global

USA . 1,000 parts In-Stock

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$0.577

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$0.554

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$0.577

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Ampacity Inc.

Singapore . 447 parts In-Stock

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$0.600

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Corphita

USA . 96 parts In-Stock

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$1.179

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AZTECH Wire

Italy . 579 parts In-Stock

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Metaverse IC Inc.

Canada . 60,000 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Unlock a world of possibilities with the SFH3201 phototransistor by Infineon Technologies. Trust in the renowned quality and expertise of Infineon to deliver superior performance in a variety of applications. Whether you're looking to enhance your proximity sensor, ambient light sensor, or even your industrial automation system, the SFH3201 offers unmatched value, benefits, and advantages. Experience reliability, precision, and efficiency like never before with the SFH3201 from Infineon. Elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Peak Wavelength: 860 nm

This specific peak wavelength makes the phototransistor suitable for applications requiring detection in the infrared spectrum.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this phototransistor can withstand heat and perform reliably under varying environmental conditions.

Minimum Operating Temperature: -55 °C

The wide range of minimum operating temperature allows this product to be used in extreme cold environments without loss of performance.

Maximum Power Dissipation: 0.165 W

The low power dissipation ensures that the phototransistor operates efficiently without generating excess heat.

Maximum Dark Current: 200 nA

The low dark current ensures accurate detection and prevents false readings in low light conditions.

Maximum Response Time: 0.000005 s

With an extremely fast response time, this phototransistor can quickly detect changes in light intensity for near real-time applications.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy and secure installation on circuit boards, making it ideal for compact electronic devices.

Maximum On State Current: 0.015 A

This high maximum on-state current ensures that the phototransistor can handle high levels of light intensity without being damaged.

Technical Specifications

Phototransistors SFH3201 attributes and parameters. Explore more Phototransistors devices from Infineon Technologies

Specs

Maximum Dark Current:

200 nA

Mounting Feature:

Maximum On State Current:

.015 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Peak Wavelength (nm):

860

Maximum Power Dissipation:

.165 W

Maximum Response Time:

.000005 s

Sub-Category:

Photo Transistors

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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