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S6J342AFTBSV20000

Infineon Technologies

S6J342AFTBSV20000 by Infineon Technologies

The Infineon Technologies S6J342AFTBSV20000 is a 32-bit microcontroller with a max clock frequency of 48 MHz. It features 75 I/O lines, ADC channels, and PWM channels, making it ideal for applications requiring high-speed processing and precise control, such as automotive electronics and industrial automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 863 parts In-Stock

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Digiode

USA . 525 parts In-Stock

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525

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,383 parts In-Stock

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$16.000

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1,383

$16.000

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Microchip USA

USA . 939 parts In-Stock

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$21.315

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939

$21.315

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Modulus Dynamics

Lithuania . 833 parts In-Stock

1+ parts

$23.505

100+ parts

$22.565

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$21.625

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833

$23.505

$22.565

$21.625

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Argo Parts USA

USA . 4,726 parts In-Stock

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4,726

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Continental Prestige Electronics

USA . 1,027 parts In-Stock

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Corphita

USA . 495 parts In-Stock

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495

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Enhance your electronic designs with the high-quality S6J342AFTBSV20000 microcontroller by Infineon Technologies. Engineered to deliver exceptional performance and reliability, this product is perfect for a wide range of applications. With its advanced features and cutting-edge technology, customers can expect seamless integration and superior functionality. Trust in Infineon's expertise and innovation to take your projects to the next level. Experience the value and benefits that this microcontroller provides, and unlock endless possibilities for your creations.

Feature Benefit Bullets

Surface Mount: YES

Surface mounting allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in system design.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, making it suitable for compact designs.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and performance, suitable for demanding applications.

No. of Terminals: 100

The large number of terminals allows for a wide range of connectivity options, enabling versatile interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and facilitates high-density PCB design.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures efficient operation even with lower power sources, improving energy efficiency.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, essential for interfacing with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position enhances stability and reliability of the connections, minimizing the risk of signal interference.

Width: 14 mm

The compact width of 14mm allows for space-efficient placement on the PCB, ideal for designs with size constraints.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz provides fast processing speeds, suitable for real-time applications and high-performance tasks.

Length: 14 mm

The short length of 14mm contributes to a compact overall footprint, aiding in miniaturization of the final product.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of a RISC architecture in a microcontroller allows for efficient and streamlined execution of instructions, enhancing overall system performance.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and reliable solder joints, ensuring robust connectivity in diverse operating conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides a stable power source for the microcontroller, ensuring consistent and reliable operation.

PWM Channels: YES

The availability of PWM channels enables precise control of the output signals, crucial for applications requiring accurate modulation of signals.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm promotes high-density packaging and facilitates close component placement, enhancing overall PCB layout efficiency.

Speed: 132 rpm

The operating speed of 132 rpm indicates the capability of the microcontroller to process tasks quickly and efficiently, meeting the performance demands of various applications.

No. of I/O Lines: 75

With 75 I/O lines, the microcontroller offers a versatile interface for input and output operations, enabling seamless communication with external devices and peripherals.

Technical Specifications

Microcontrollers S6J342AFTBSV20000 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

14 mm

No. of I/O Lines:

75

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

132 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

S6J342AFTBSV20000 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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