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S29WS256P0PBFW000

Infineon Technologies

S29WS256P0PBFW000 by Infineon Technologies

S29WS256P0PBFW000 by Infineon is a 16Mx16 NOR flash memory with 8,254 sectors and 16K/64K sector size. Operating at 1.8V, it offers fast access time of 80ns and low standby current of 0.000005Amp. Ideal for applications requiring high-density memory with parallel interface and common flash interface support.

Median Price

$14.220

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,324 parts In-Stock

1+ parts

-

100+ parts

$15.800

1k+ parts

$14.137

10k+ parts

$13.313

2,324

-

$15.800

$14.137

$13.313

Rochester

USA . 2,324 parts In-Stock

1+ parts

-

100+ parts

$12.640

1k+ parts

$11.310

10k+ parts

$10.650

2,324

-

$12.640

$11.310

$10.650

Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.073

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.073

-

-

-

Cyclops Electronics Ltd

UK . 4,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,200

-

-

-

-

Chip Stock

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

-

-

-

-

Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Vyrian

USA . 1,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,829

-

-

-

-

Digiode

USA . 958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

958

-

-

-

-

Atlantic Semiconductor

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,639 parts In-Stock

1+ parts

$3.830

100+ parts

$3.677

1k+ parts

$3.524

10k+ parts

-

1,639

$3.830

$3.677

$3.524

-

Continental Prestige Electronics

USA . 2,691 parts In-Stock

1+ parts

$7.073

100+ parts

-

1k+ parts

-

10k+ parts

$6.932

2,691

$7.073

-

-

$6.932

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Argo Parts USA

USA . 3,050 parts In-Stock

1+ parts

-

100+ parts

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3,050

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-

-

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Microchip USA

USA . 2,179 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,179

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-

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Corphita

USA . 244 parts In-Stock

1+ parts

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100+ parts

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244

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Perfect Parts

USA . 31 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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31

-

-

-

-

Overview

Unlock the power of reliable and high-quality flash memory with the S29WS256P0PBFW000 by Infineon Technologies. Designed with precision and expertise, this flash memory device offers unparalleled performance and efficiency for a wide range of applications. With its advanced technology and robust construction, this product ensures seamless operation and data storage, making it an ideal choice for demanding projects. Trust in Infineon's reputation for excellence and innovation, and experience the value and benefits that the S29WS256P0PBFW000 brings to your next project. Elevate your performance with this superior flash memory solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the flash memory, ensuring a longer lifespan.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Operating Mode: ASYNCHRONOUS

Allows for independent operations and faster data transfer speeds.

Nominal Supply Voltage / Vsup (V): 1.8

Efficient power consumption and compatibility with standard voltage levels in electronic devices.

Organization: 16MX16

High organization capacity for storing large amounts of data in a compact form.

Memory IC Type: FLASH

Flash memory technology offers fast read and write speeds, making it ideal for applications requiring quick data access.

Technical Specifications

Flash Memory S29WS256P0PBFW000 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Access Time:

80 ns

Additional Features:

SYNCHRONOUS BURST MODE OPERATION POSSIBLE

Boot Block:

BOTTOM/TOP

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B84

JESD-609 Code:

e1

Length:

11.6 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

8,254

No. of Terminals:

84

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,10X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Page Size (words):

8

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Programming Voltage (V):

1.8

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1 mm

Sector Size (Words):

16K,64K

Maximum Standby Current:

.000005 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Toggle Bit:

YES

Type:

NOR TYPE

Width:

8 mm

Trade Compliance

S29WS256P0PBFW000 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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