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S29GL256S11FHIV10

Infineon Technologies

S29GL256S11FHIV10 by Infineon Technologies

Infineon's S29GL256S11FHIV10 EEPROM offers 16Mx16 organization, 256 sectors of 64K words each, and operates at a max temperature of 85°C. Ideal for industrial applications, this NOR type memory card features a parallel interface with a low profile grid array package and asynchronous operation mode.

Median Price

$6.976

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 64 parts In-Stock

1+ parts

$4.669

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$4.669

-

-

-

Chip1Stop

Japan . 74 parts In-Stock

1+ parts

$6.570

100+ parts

$6.029

1k+ parts

-

10k+ parts

-

74

$6.570

$6.029

-

-

Mouser Electronics

USA . 728 parts In-Stock

1+ parts

$10.470

100+ parts

$8.990

1k+ parts

$8.250

10k+ parts

-

728

$10.470

$8.990

$8.250

-

Avnet

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.976

10k+ parts

$6.161

1,500

-

-

$6.976

$6.161

Rochester

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$5.660

1k+ parts

$5.070

10k+ parts

$4.770

170

-

$5.660

$5.070

$4.770

DigiKey

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$7.450

1k+ parts

-

10k+ parts

-

170

-

$7.450

-

-

Verical

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$7.075

1k+ parts

$6.338

10k+ parts

$5.963

170

-

$7.075

$6.338

$5.963

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 389 parts In-Stock

1+ parts

$4.907

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$4.907

-

-

-

Digiode

USA . 10 parts In-Stock

1+ parts

$5.263

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$5.263

-

-

-

DigiKey Marketplace

USA . 170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

170

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 372 parts In-Stock

1+ parts

$4.371

100+ parts

$4.196

1k+ parts

$4.021

10k+ parts

-

372

$4.371

$4.196

$4.021

-

Corphita

USA . 288 parts In-Stock

1+ parts

$4.986

100+ parts

-

1k+ parts

-

10k+ parts

-

288

$4.986

-

-

-

Component Stockers USA

USA . 1,560 parts In-Stock

1+ parts

$5.750

100+ parts

$5.400

1k+ parts

-

10k+ parts

-

1,560

$5.750

$5.400

-

-

Microchip USA

USA . 1,154 parts In-Stock

1+ parts

$19.550

100+ parts

$19.270

1k+ parts

$19.130

10k+ parts

$18.990

1,154

$19.550

$19.270

$19.130

$18.990

QUARKTWIN TECHNOLOGY LTD

USA . 7,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,118

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,927 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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5,927

-

-

-

-

Lixinc

USA . 5,011 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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5,011

-

-

-

-

Kepictronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unleash the power of reliable data storage with the S29GL256S11FHIV10 by Infineon Technologies. Crafted with precision and expertise, this EEPROM offers unmatched quality and performance. Ideal for industrial applications, this versatile memory card provides seamless operation and secure data storage. Experience the value of superior technology and innovative design with Infineon's S29GL256S11FHIV10. Unlock endless possibilities with this cutting-edge solution that guarantees efficiency, reliability, and peace of mind for all your data storage needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the EEPROM, ensuring long-term reliability.

Surface Mount: YES

Surface mount packaging allows for easy integration onto circuit boards, saving space and simplifying assembly.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent and flexible access to the EEPROM's data, enhancing performance and versatility.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a standard 3V supply voltage, compatible with many systems and devices.

No. of Terminals: 64

With 64 terminals, this EEPROM provides ample connectivity options for seamless integration into various applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this EEPROM energy-efficient and reliable.

Data Polling: YES

Supports data polling, allowing for efficient data retrieval and processing, enhancing overall performance.

Technical Specifications

EEPROM S29GL256S11FHIV10 attributes and parameters. Explore more EEPROM devices from Infineon Technologies

Specs

Maximum Access Time:

110 ns

Command User Interface:

YES

Common Flash Interface:

YES

Data Polling:

YES

JESD-30 Code:

R-PBGA-B64

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Sectors/Size:

256

No. of Terminals:

64

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Page Size (words):

16

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.4 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

80 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11 mm

Trade Compliance

S29GL256S11FHIV10 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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