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PVG613PBF

Infineon Technologies

PVG613PBF by Infineon Technologies

PVG613PBF by Infineon Technologies is a SINGLE MOSFET SSR with 0.025 A forward current, 1 A on-state current, and 0.5 ohm on-state resistance. Ideal for applications requiring AC/DC input type, it offers 4000 V isolation voltage and operates b/w -40 to 85 °C temperatures.

Median Price

$5.950

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,231 parts In-Stock

1+ parts

-

100+ parts

$4.760

1k+ parts

$4.260

10k+ parts

$4.010

10,231

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$4.760

$4.260

$4.010

DigiKey

USA . 9,704 parts In-Stock

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$6.260

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9,704

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$6.260

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Verical

USA . 5,887 parts In-Stock

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$5.950

1k+ parts

$5.325

10k+ parts

$5.013

5,887

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$5.950

$5.325

$5.013

Distributors (In-Stock)

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Digiode

USA . 997 parts In-Stock

1+ parts

$5.044

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997

$5.044

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Vyrian

USA . 558 parts In-Stock

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$5.310

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558

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Voyager Components

USA . 1,346 parts In-Stock

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$13.225

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$13.225

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DigiKey Marketplace

USA . 10,277 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 291 parts In-Stock

1+ parts

$0.389

100+ parts

$0.373

1k+ parts

$0.358

10k+ parts

-

291

$0.389

$0.373

$0.358

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Corphita

USA . 778 parts In-Stock

1+ parts

$4.779

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778

$4.779

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A-Z Elektronik GmbH

Germany . 7,484 parts In-Stock

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7,484

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Perfect Parts

USA . 2,128 parts In-Stock

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Kepictronics

USA . 1,130 parts In-Stock

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Overview

Unleash the power of innovation with the PVG613PBF by Infineon Technologies. As a leader in solid state relays, Infineon delivers top-quality products that offer unmatched reliability and performance. The PVG613PBF is designed for a wide range of applications, providing customers with a versatile solution for their needs. With its cutting-edge technology and exceptional features, this solid state relay offers unrivaled value, efficiency, and peace of mind. Experience the difference with Infineon Technologies and elevate your projects to new heights.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to install and use in various applications.

Control Current: 0.005 A

Low control current requirement helps in energy efficiency and reduces power consumption.

Maximum Forward Current: 0.025 A

Capable of handling high forward current ensuring reliable performance.

Optoelectronic Type: TRANSISTOR OUTPUT SSR

Transistor output SSR offers fast switching speed and high reliability.

Output Circuit Type: MOSFET

MOSFET output circuit type provides low on-state resistance for efficient operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for use in a wide range of environments.

Height: 3.4 mm

Compact design with low height makes it suitable for space-constrained applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Maximum On State Resistance: 0.5 ohm

Low on-state resistance minimizes power loss and heat generation.

Maximum Isolation Voltage: 4000 V

High isolation voltage provides safety and protection against voltage spikes.

Input Type: AC/DC

Supports both AC and DC input types for versatile compatibility.

Length: 8.6 mm

Small length allows for easy integration in different systems.

Maximum On State Current: 1 A

High maximum on-state current rating enables it to switch higher loads effectively.

Technical Specifications

Solid State Relays PVG613PBF attributes and parameters. Explore more Solid State Relays devices from Infineon Technologies

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SINGLE

Control Current:

.005 A

Maximum Forward Current:

.025 A

Input Type:

AC/DC

Maximum Isolation Voltage:

4000 V

No. of Elements:

1

Maximum On State Current:

1 A

Maximum On State Resistance:

.5 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Output Circuit Type:

MOSFET

Height:

3.4 mm

Length:

8.6 mm

Sub-Category:

Solid State Relays

Trade Compliance

PVG613PBF Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.95.00

SB

8541.40.95.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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