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PVG612S

Infineon Technologies

PVG612S by Infineon Technologies

TRANSISTOR OUTPUT SSR; Additional Features: UL RECOGNIZED; Maximum Isolation Voltage: 4000 V; Maximum On State Current: 1 A; Maximum On State Resistance: .5 ohm; Maximum Forward Current: .025 A;

Median Price

$7.494

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 436 parts In-Stock

1+ parts

$7.480

100+ parts

$5.930

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436

$7.480

$5.930

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Freelance Electronics

USA . 102 parts In-Stock

1+ parts

$7.507

100+ parts

$7.883

1k+ parts

$7.432

10k+ parts

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102

$7.507

$7.883

$7.432

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Component Electronics Inc.

Canada . 50 parts In-Stock

1+ parts

$9.620

100+ parts

$7.210

1k+ parts

$6.250

10k+ parts

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50

$9.620

$7.210

$6.250

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Chip Stock

USA . 3,300 parts In-Stock

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3,300

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Digiode

USA . 900 parts In-Stock

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900

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Vyrian

USA . 489 parts In-Stock

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489

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QIE Inc.

USA . 352 parts In-Stock

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352

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North Shore Components

USA . 252 parts In-Stock

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Q Components

USA . 160 parts In-Stock

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160

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MRC Electronics

USA . 155 parts In-Stock

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Cogito LLC

Ukraine . 108 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 89 parts In-Stock

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Inventory MP

USA . 87 parts In-Stock

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Bristol Electronics

USA . 75 parts In-Stock

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Sunrise Surplus Inc.

USA . 62 parts In-Stock

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Component Sense

UK . 41 parts In-Stock

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$4.373

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$4.373

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$4.373

41

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$4.373

$4.373

$4.373

Speed Components Ltd

Israel . 37 parts In-Stock

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J2 Sourcing AB

Sweden . 33 parts In-Stock

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M&R Communications

USA . 22 parts In-Stock

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Prism Electronics

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Sea View Technologies

USA . 7 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 5,161 parts In-Stock

1+ parts

$0.689

100+ parts

$0.661

1k+ parts

$0.634

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5,161

$0.689

$0.661

$0.634

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RC Electronics

USA . 7,242 parts In-Stock

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$5.980

1k+ parts

$5.460

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$5.290

7,242

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$5.980

$5.460

$5.290

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kepictronics

USA . 1,050 parts In-Stock

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Metaverse IC Inc.

Canada . 1,035 parts In-Stock

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Corphita

USA . 778 parts In-Stock

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778

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Perfect Parts

USA . 20 parts In-Stock

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Technical Specifications

Solid State Relays PVG612S attributes and parameters. Explore more Solid State Relays devices from Infineon Technologies

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SINGLE

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

4000 V

No. of Elements:

1

Maximum On State Current:

1 A

Maximum On State Resistance:

.5 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Trade Compliance

PVG612S Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.95.00

SB

8541.40.95.00

NSN

5945-01-625-5324, 5945016255324

NIIN

016255324

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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