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MB96F338USAPMC-GSE2

Infineon Technologies

MB96F338USAPMC-GSE2 by Infineon Technologies

Infineon's MB96F338USAPMC-GSE2 microcontroller features 16-bit CPU, 24-bit address bus, and 56 MHz clock frequency. Ideal for industrial applications requiring high-speed processing, with 32768 bytes of RAM and flash ROM programmability. Package style is flatpack with low profile and fine pitch, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 780 parts In-Stock

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780

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Vyrian

USA . 723 parts In-Stock

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723

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Modulus Dynamics

Lithuania . 2,400 parts In-Stock

1+ parts

$22.977

100+ parts

$22.058

1k+ parts

$21.139

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2,400

$22.977

$22.058

$21.139

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Argo Parts USA

USA . 3,333 parts In-Stock

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3,333

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 850 parts In-Stock

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850

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Corphita

USA . 564 parts In-Stock

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564

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock endless possibilities with the MB96F338USAPMC-GSE2 by Infineon Technologies. Designed with excellence in mind, this microcontroller offers unmatched quality and reliability. From industrial automation to automotive applications, this powerful device delivers exceptional performance and efficiency. Experience seamless operation with a maximum clock frequency of 56 MHz and 124 I/O lines for enhanced functionality. Trust Infineon Technologies to provide cutting-edge solutions that elevate your projects to new heights. Explore the world of innovation with the MB96F338USAPMC-GSE2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the microcontroller easy to handle and install.

Surface Mount: YES

Surface mount technology allows for a more compact design and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

Offers a wide voltage range for flexibility in power supply options.

Address Bus Width: 24

A wide address bus allows for larger memory addressing capabilities and more efficient data retrieval.

Package Shape: SQUARE

Square packages are easier to handle and integrate into circuit designs.

Bit Size: 16

Offers a good balance between processing power and efficiency for many applications.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, accommodating a variety of system requirements.

No. of Terminals: 144

Provides plenty of I/O options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a low profile for space-constrained applications and fine pitch for high-density mounting.

Minimum Supply Voltage: 3 V

Allows for operation at lower voltages for power savings and compatibility with different power sources.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial applications.

CPU Family: F2MC-16F

Part of a reputable CPU family known for high performance and reliability.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, ideal for a wide range of environments.

ADC Channels: YES

Integrated ADC channels provide analog input capabilities for sensor interfacing and data conversion.

DMA Channels: YES

Support for DMA channels enables efficient data transfer and processing without CPU intervention.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and facilitates a more organized wiring arrangement.

ROM Words: 557056

Generous ROM size allows for storing a large amount of program data and instructions.

Width: 20 mm

Compact width dimension helps save space on the PCB and enables more compact device designs.

External Data Bus Width: 16

A wide external data bus supports efficient data transfer between the microcontroller and external memory devices.

Maximum Clock Frequency: 56 MHz

High clock frequency enables fast processing speeds for demanding tasks and real-time applications.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the assembly process, ensuring reliable solder joints.

Length: 20 mm

Compact length dimension helps save space on the PCB and enables more compact device designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller for embedded system applications, providing all necessary peripheral functions.

RAM Bytes: 32768

A generous amount of RAM allows for efficient data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections and ease of PCB assembly.

Maximum Supply Current: 71 mA

Low supply current consumption helps save power and prolong battery life in portable applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3V is common in many electronic systems, ensuring compatibility.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals and motor speed regulation.

ROM Programmability: FLASH

Programmable flash memory allows for easy firmware updates and reprogramming of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and space-saving PCB layout.

Speed: 56 rpm

High processing speed of 56 rpm enables quick response times and efficient operation of the microcontroller.

No. of I/O Lines: 124

Abundant I/O lines provide ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MB96F338USAPMC-GSE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

F2MC-16F

Maximum Clock Frequency:

56 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

124

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

557056

ROM Programmability:

FLASH

Speed:

56 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

71 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MB96F338USAPMC-GSE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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