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MB96F336UWAPMC-GSE2

Infineon Technologies

MB96F336UWAPMC-GSE2 by Infineon Technologies

Infineon's MB96F336UWAPMC-GSE2 microcontroller features 16-bit CPU, 24-bit address bus, and 56 MHz clock frequency. Ideal for industrial applications, it offers 294912 ROM words, 24576 RAM bytes, and supports ADC and DMA channels.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 712 parts In-Stock

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Vyrian

USA . 613 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 484 parts In-Stock

1+ parts

$34.187

100+ parts

$32.820

1k+ parts

$31.452

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484

$34.187

$32.820

$31.452

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Corohmni

South Africa . 221 parts In-Stock

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$52.289

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$73.940

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$73.940

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$73.940

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2,000

$73.940

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Argo Parts USA

USA . 4,552 parts In-Stock

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Continental Prestige Electronics

USA . 4,445 parts In-Stock

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4,445

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Corphita

USA . 343 parts In-Stock

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343

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the MB96F336UWAPMC-GSE2 microcontroller from Infineon Technologies. With its cutting-edge technology and reliable performance, this microcontroller is perfect for a wide range of applications. Whether you're designing automotive systems, consumer electronics, or industrial equipment, this product offers unmatched value and flexibility. Experience seamless integration, high efficiency, and superior functionality with the MB96F336UWAPMC-GSE2. Elevate your projects to new heights with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and light weight, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources.

Address Bus Width: 24

A 24-bit address bus width allows for access to a large memory space, enabling the Microcontroller to handle complex operations.

Package Shape: SQUARE

Square package shape provides a compact form factor, making it easy to fit into tight spaces in electronic designs.

Bit Size: 16

16-bit architecture enables efficient processing of data and instructions, suitable for a variety of applications requiring moderate processing power.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 144

144 terminals provide ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style allows for easy mounting and soldering on PCBs, enhancing ease of assembly.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures reliable operation even with low-voltage power sources.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the Microcontroller is suitable for use in industrial environments with elevated temperatures.

CPU Family: F2MC-16F

Part of the F2MC-16F CPU family, known for its performance, reliability, and efficiency in embedded system applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the Microcontroller can operate effectively in harsh cold environments.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing and conversion, expanding the range of sensors and devices that can be interfaced with the Microcontroller.

DMA Channels: YES

Support for DMA channels enables efficient data transfer and processing, reducing the workload on the CPU and improving overall system performance.

Terminal Position: QUAD

Quad terminal position configuration simplifies PCB layout and routing, making it easier to connect external components.

ROM Words: 294912

With 294912 ROM words, the Microcontroller offers ample storage space for program instructions and data, suitable for complex applications.

Width: 20 mm

Compact width of 20mm enables the Microcontroller to be used in space-constrained designs without compromising functionality.

External Data Bus Width: 16

16-bit external data bus width allows for efficient data transfer between the Microcontroller and external memory or peripherals.

Maximum Clock Frequency: 56 MHz

Support for a maximum clock frequency of 56 MHz enables fast processing speeds, ideal for real-time applications and high-performance tasks.

Length: 20 mm

Compact length of 20mm facilitates easy integration into electronic devices with limited space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a Microcontroller, this product offers a wide range of integrated peripherals and features tailored for embedded control applications.

RAM Bytes: 24576

With 24576 bytes of RAM, the Microcontroller provides sufficient memory for data storage and temporary program variables, supporting multitasking and data processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and faster switching speeds, making the Microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form factor simplifies soldering and rework processes, enhancing the overall reliability and ease of manufacturing.

Maximum Supply Current: 71 mA

Capable of operating with a maximum supply current of 71 mA, ensuring efficient power usage and reducing heat dissipation.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V offers a balanced level of power for optimal performance and compatibility with a wide range of components.

PWM Channels: YES

Integrated PWM channels enable precise control of analog output signals, essential for applications such as motor control and LED dimming.

ROM Programmability: FLASH

ROM programmability using FLASH memory technology allows for easy reprogramming of firmware and updates, enhancing system flexibility and longevity.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and miniaturization of PCB designs, saving space and reducing production costs.

Speed: 56 rpm

Operational speed of 56 revolutions per minute (rpm) signifies the capability of the Microcontroller to perform tasks quickly and efficiently.

No. of I/O Lines: 124

With 124 I/O lines, the Microcontroller offers extensive input and output capabilities for interfacing with external devices and sensors, enhancing versatility.

Technical Specifications

Microcontrollers MB96F336UWAPMC-GSE2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

F2MC-16F

Maximum Clock Frequency:

56 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

124

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

294912

ROM Programmability:

FLASH

Speed:

56 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

71 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MB96F336UWAPMC-GSE2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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