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LSGT670-J+L

Infineon Technologies

LSGT670-J+L by Infineon Technologies

LSGT670-J+L by Infineon: Visible LED with 0.03A max current, peak wavelength of 635nm, and clear lens. Ideal for applications requiring green/red light emission, with a viewing angle of 0° and max forward voltage of 2.6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

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ComSIT USA

USA . 4,000 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

Japan . 10 parts In-Stock

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Modulus Dynamics

Lithuania . 4,687 parts In-Stock

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$0.643

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$0.617

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$0.592

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AZTECH Wire

Italy . 747 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 3,017 parts In-Stock

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Argo Parts USA

USA . 1,632 parts In-Stock

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Corphita

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Aranea Global

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Overview

Unlock a world of possibilities with the LSGT670-J+L Visible LED by Infineon Technologies. With a peak wavelength of 635nm and a minimum luminous intensity of 120cd, this high-quality product offers unparalleled reliability and performance. Ideal for applications requiring precise color at wavelength such as in automotive lighting or signage, this LED boasts a clear lens type and a maximum forward current of 0.03A. Trust in the leading manufacturer, Infineon Technologies, to deliver innovative solutions that elevate your projects to new heights. Choose the LSGT670-J+L for efficiency, durability, and superior illumination.

Feature Benefit Bullets

Maximum Forward Current: 0.03 A

The low forward current requirement makes this LED energy-efficient and helps in prolonging its lifespan.

Peak Wavelength (nm): 635

The specific peak wavelength of 635nm makes this LED suitable for applications that require green/red color output with high precision.

Lens Type: CLEAR

The clear lens ensures maximum light output and clarity, making it ideal for applications where brightness and visibility are key.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this LED can withstand harsh environmental conditions without compromising performance.

Height: 1.9 mm

The compact height allows for easy integration into various devices and applications where space is limited.

Minimum Operating Temperature: -55 °C

The wide temperature range at which this LED can operate ensures functionality in extreme cold environments.

Minimum Luminous Intensity: 120 cd

The high luminous intensity ensures a bright and visible output, making this LED suitable for applications where visibility is critical.

Color At Wavelength: Green/Red

The specific color output at the wavelength of 635nm makes this LED suitable for applications that require green/red colors with accuracy.

Maximum Reverse Voltage: 5 V

The low reverse voltage rating enhances the overall safety and reliability of the LED in various circuits and applications.

Viewing Angle: 0°

The narrow viewing angle of 0° allows for precise light direction and focus, making it ideal for specific lighting applications.

Maximum Forward Voltage: 2.6 V

The low forward voltage requirement ensures efficient power consumption and compatibility with various power sources.

Technical Specifications

Visible LEDs LSGT670-J+L attributes and parameters. Explore more Visible LEDs devices from Infineon Technologies

Specs

Color At Wavelength:

Green/Red

Maximum Forward Current:

.03 A

Maximum Forward Voltage:

2.6 V

Lens Type:

Minimum Luminous Intensity:

120 cd

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-55 Cel

Height:

1.9 mm

Peak Wavelength (nm):

635

Maximum Reverse Voltage:

5 V

Sub-Category:

Visible LEDs

Viewing Angle:

0 deg

Trade Compliance

LSGT670-J+L Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.20.00

SB

8541.40.20.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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