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LHI958

Infineon Technologies

LHI958 by Infineon Technologies

LHI958 by Infineon Technologies is an Infrared Sensor with a spectral response of 8000-14000 nm. It has a min responsivity of 2300 V/W and operates b/w -40 to 70°C. Ideal for applications requiring pyroelectric sensors, it features LiTaO semiconductor material and tin/lead terminal finish for through hole mounting.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 2,850 parts In-Stock

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Vyrian

USA . 649 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Cyclops Electronics Ltd

UK . 79 parts In-Stock

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Digiode

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Modulus Dynamics

Lithuania . 309 parts In-Stock

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$3.024

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$2.903

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$2.782

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309

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Kepictronics

USA . 7,856 parts In-Stock

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Continental Prestige Electronics

USA . 3,866 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

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Argo Parts USA

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Overview

Experience unparalleled quality with the LHI958 infrared sensor by Infineon Technologies. This cutting-edge sensor offers a wide range of applications, from detecting movement to monitoring temperature changes. Infineon Technologies, known for their innovative solutions and superior manufacturing processes, delivers a product that guarantees reliability and precision. Unlock endless possibilities with the LHI958 and enjoy the value, benefits, and advantages it brings to your projects and applications.

Feature Benefit Bullets

Sensors or Transducers Type: INFRARED SENSOR,PYROELECTRIC

Pyroelectric sensors are known for their high sensitivity to infrared radiation, making this sensor a great choice for applications requiring accurate and precise detection of heat signals.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this sensor can withstand high temperatures, making it suitable for a wide range of industrial and commercial applications.

Minimum Responsivity: 2300 V/W

The high responsivity of 2300 V/W indicates that this sensor can quickly and accurately convert incoming infrared radiation into an electrical signal, ensuring reliable and precise detection.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this sensor to function effectively even in extremely cold environments, making it suitable for outdoor and harsh conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and conductivity, ensuring reliable electrical connections and long-lasting performance of the sensor.

Spectral Response (nm): 8000-14000

With a spectral response range of 8000-14000 nanometers, this sensor is capable of detecting a wide spectrum of infrared radiation, making it versatile for various applications.

Semiconductor Material: LiTaO

LiTaO is a high-quality semiconductor material known for its stability and performance in infrared sensors, ensuring the sensor's durability and accuracy in detecting infrared radiation.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature makes it easy to install and secure the sensor on a circuit board or device, providing a stable and reliable connection for accurate detection of infrared signals.

Technical Specifications

Infrared Sensors LHI958 attributes and parameters. Explore more Infrared Sensors devices from Infineon Technologies

Specs

JESD-609 Code:

e0

Mounting Feature:

No. of Channels:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Responsivity:

2300 V/W

Semiconductor Material:

LiTaO

Sensors or Transducers Type:

Spectral Response (nm):

8000-14000

Sub-Category:

Infrared Sensors

Terminal Finish:

Tin/Lead (Sn/Pb)

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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