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IRL540NSTRRPBF

Infineon Technologies

IRL540NSTRRPBF by Infineon Technologies

IRL540NSTRRPBF by Infineon is a N-CHANNEL FET with 100V DS breakdown voltage and 36A max drain current. Ideal for switching applications, it features a built-in diode, 0.053 ohm on-resistance, and 120A pulsed drain current. Suitable for enhancement mode operation in surface mount designs.

Median Price

$1.198

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$1.198

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500

$1.198

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Chip Stock

USA . 44,040 parts In-Stock

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44,040

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Zilex Electronics Inc.

Canada . 2,500 parts In-Stock

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2,500

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Digiode

USA . 902 parts In-Stock

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902

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ComSIT Distribution GmbH

Germany . 825 parts In-Stock

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825

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Vyrian

USA . 375 parts In-Stock

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375

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ComSIT USA

USA . 255 parts In-Stock

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$1.174

100+ parts

-

1k+ parts

$1.127

10k+ parts

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100

$1.174

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$1.127

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Continental Prestige Electronics

USA . 5,599 parts In-Stock

1+ parts

$1.198

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$1.174

5,599

$1.198

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$1.174

Argo Parts USA

USA . 1,732 parts In-Stock

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$1.198

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1,732

$1.198

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Modulus Dynamics

Lithuania . 4,722 parts In-Stock

1+ parts

$1.388

100+ parts

$1.332

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$1.277

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4,722

$1.388

$1.332

$1.277

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AZTECH Wire

Italy . 266 parts In-Stock

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$8.121

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266

$8.121

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Ampacity Inc.

Singapore . 882 parts In-Stock

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$37.050

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882

$37.050

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,216 parts In-Stock

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Glotronic Ltd.

UK . 1,965 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 63 parts In-Stock

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Overview

Unleash the power of the IRL540NSTRRPBF by Infineon Technologies, a top-tier manufacturer known for its high-quality Power Field Effect Transistors (FET). With a focus on switching applications, this N-channel transistor offers unparalleled performance and reliability. Its single configuration with built-in diode makes it a versatile choice for various electronic projects. Experience enhanced efficiency and durability with a maximum drain current of 36A and a low on-resistance of 0.053 ohm. Trust in the expertise of Infineon Technologies and elevate your design with the IRL540NSTRRPBF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow and improved performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design and saves space, making it a cost-effective solution.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in that use case.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, the FET can withstand high voltage levels, making it suitable for various applications.

Package Shape: RECTANGULAR

Provides a compact and space-saving design for easier integration into electronic devices.

Terminal Form: GULL WING

Facilitates easy soldering and reliable connections, ensuring stability during operation.

Operating Mode: ENHANCEMENT MODE

Allows for efficient control of the transistor's conductance, improving overall performance.

Maximum Pulsed Drain Current (IDM): 120 A

Capable of handling high current levels during pulsed operation, making it suitable for power applications.

Avalanche Energy Rating (EAS): 310 mJ

Provides protection against avalanche breakdown, ensuring the FET's reliability in harsh conditions.

No. of Terminals: 2

Simplifies the circuit layout and reduces complexity, making it easier to integrate into existing designs.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and allows for dense PCB layouts in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and low power consumption, making it suitable for energy-efficient applications.

Transistor Element Material: SILICON

Provides high performance and reliability, ensuring the FET operates effectively over an extended period.

Terminal Finish: MATTE TIN OVER NICKEL

Ensures good solderability and corrosion resistance for reliable connections and long-term usability.

Maximum Drain Current (ID): 36 A

Capable of handling high continuous current levels, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.053 ohm

Low on-resistance results in minimal power loss and improved efficiency during operation.

Terminal Position: SINGLE

Simplifies the connection process and reduces the risk of errors during assembly.

Case Connection: DRAIN

Provides a secure connection for efficient heat dissipation, ensuring the FET's reliability under high load conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures the FET can withstand peak reflow temperatures without compromising its performance or reliability.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes, ensuring the FET remains operational and reliable.

Technical Specifications

Power Field Effect Transistors (FET) IRL540NSTRRPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

310 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.053 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRL540NSTRRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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