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IPS80R600P7AKMA1

Infineon Technologies

IPS80R600P7AKMA1 by Infineon Technologies

Infineon's IPS80R600P7AKMA1 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for switching applications. Featuring a single configuration with built-in diode, it offers 0.6 ohm max RDS(on) and 22A IDM. Operating in enhancement mode, this MOSFET has an EAS of 20mJ and operates at -55°C min temp.

Median Price

$1.014

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 147 parts In-Stock

1+ parts

$2.640

100+ parts

$1.900

1k+ parts

$0.863

10k+ parts

$0.739

147

$2.640

$1.900

$0.863

$0.739

Rochester

USA . 19,480 parts In-Stock

1+ parts

-

100+ parts

$0.885

1k+ parts

$0.735

10k+ parts

$0.655

19,480

-

$0.885

$0.735

$0.655

Verical

USA . 19,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.918

10k+ parts

$0.819

19,480

-

-

$0.918

$0.819

DigiKey

USA . 2,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.110

10k+ parts

-

2,980

-

-

$1.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 204 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

204

$0.690

-

-

-

Vyrian

USA . 801 parts In-Stock

1+ parts

$0.726

100+ parts

-

1k+ parts

-

10k+ parts

-

801

$0.726

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 723 parts In-Stock

1+ parts

$0.653

100+ parts

-

1k+ parts

-

10k+ parts

-

723

$0.653

-

-

-

Component Stockers USA

USA . 17,152 parts In-Stock

1+ parts

$0.750

100+ parts

$0.700

1k+ parts

$0.630

10k+ parts

$0.630

17,152

$0.750

$0.700

$0.630

$0.630

Modulus Dynamics

Lithuania . 16,171 parts In-Stock

1+ parts

$1.022

100+ parts

$0.981

1k+ parts

$0.940

10k+ parts

-

16,171

$1.022

$0.981

$0.940

-

Microchip USA

USA . 300 parts In-Stock

1+ parts

$5.395

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$5.395

-

-

-

Perfect Parts

USA . 8,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,764

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the IPS80R600P7AKMA1 by Infineon Technologies. This high-quality N-CHANNEL power FET offers unparalleled performance and reliability for switching applications. With a robust construction and innovative design, this transistor provides customers with exceptional value and efficiency. Whether you're looking to enhance your electronic devices or optimize energy management systems, the IPS80R600P7AKMA1 is the perfect solution for all your power needs. Trust in Infineon Technologies to deliver superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides impact resistance and durability, making the transistor suitable for diverse applications.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, ensuring reliability in high-power applications.

Maximum Pulsed Drain Current (IDM): 22 A

The high pulsed drain current rating allows the transistor to handle surges of current effectively, making it suitable for switching applications.

Avalanche Energy Rating (EAS): 20 mJ

The low avalanche energy rating indicates that the transistor can withstand avalanche breakdown without being damaged, enhancing its robustness.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of metal-oxide semiconductor technology enhances the performance and efficiency of the transistor, making it a reliable choice for switching applications.

Maximum Drain-Source On Resistance: 0.6 ohm

The low on-resistance allows for efficient power switching with minimal power loss, making this transistor an energy-efficient choice.

Technical Specifications

Power Field Effect Transistors (FET) IPS80R600P7AKMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

20 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

22 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPS80R600P7AKMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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