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IPI110N20N3GAKSA1

Infineon Technologies

IPI110N20N3GAKSA1 by Infineon Technologies

IPI110N20N3GAKSA1 by Infineon Technologies is a N-CHANNEL Power FET with 200V DS Breakdown Voltage and 0.011 ohm Drain-Source On Resistance. It is used for SWITCHING applications, featuring a max IDM of 352A and EAS of 560mJ. Operating in ENHANCEMENT MODE, it has a max ID of 88A and can withstand up to 175°C temperature.

Median Price

$4.590

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,450 parts In-Stock

1+ parts

-

100+ parts

$4.080

1k+ parts

$3.650

10k+ parts

$3.430

10,450

-

$4.080

$3.650

$3.430

Verical

USA . 10,450 parts In-Stock

1+ parts

-

100+ parts

$5.100

1k+ parts

$4.563

10k+ parts

$4.287

10,450

-

$5.100

$4.563

$4.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,173 parts In-Stock

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-

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5,173

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Digiode

USA . 324 parts In-Stock

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324

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.772

100+ parts

$1.613

1k+ parts

$1.453

10k+ parts

-

600

$1.772

$1.613

$1.453

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Ampacity Inc.

Singapore . 10,291 parts In-Stock

1+ parts

$3.860

100+ parts

-

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-

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10,291

$3.860

-

-

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Modulus Dynamics

Lithuania . 16,591 parts In-Stock

1+ parts

$5.086

100+ parts

$4.883

1k+ parts

$4.679

10k+ parts

-

16,591

$5.086

$4.883

$4.679

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AZTECH Wire

Italy . 463 parts In-Stock

1+ parts

$19.420

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-

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463

$19.420

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Perfect Parts

USA . 1,809 parts In-Stock

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1,809

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Corphita

USA . 231 parts In-Stock

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231

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Overview

Unlock the power of efficient switching with the IPI110N20N3GAKSA1 by Infineon Technologies. Designed with top-quality materials and advanced technology, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in various applications. From industrial machinery to automotive systems, this transistor's built-in diode and high breakdown voltage ensure reliable operation under demanding conditions. Experience seamless functionality and enhanced efficiency with the IPI110N20N3GAKSA1, providing value and benefits that exceed expectations. Elevate your projects with this innovative solution from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower on-resistance compared to P-channel FETs, making them a good choice for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching applications, reducing the need for additional components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation in such scenarios.

Minimum DS Breakdown Voltage: 200 V

The high minimum breakdown voltage allows the transistor to handle high voltage operations, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 352 A

The high maximum pulsed drain current rating ensures the transistor can handle surges and high current pulses without damage.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can operate in a wide range of environments and conditions.

Maximum Drain Current (ID): 88 A

The high maximum drain current rating allows the transistor to handle high continuous current without overheating or failure.

Technical Specifications

Power Field Effect Transistors (FET) IPI110N20N3GAKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

560 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

88 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

352 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPI110N20N3GAKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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