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IPD200N15N3GATMA1

Infineon Technologies

IPD200N15N3GATMA1 by Infineon Technologies

IPD200N15N3GATMA1 by Infineon is a N-CHANNEL FET with 150V DS breakdown voltage, 0.02 ohm RDS(on), and 200A IDM. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in diode. Suitable for surface mount designs with GULL WING terminals in a RECTANGULAR package.

Median Price

$1.412

Lifecycle Status

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1k+

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Chip1Stop

Japan . 4,975 parts In-Stock

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$1.330

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4,975

$1.330

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Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$1.998

100+ parts

$1.898

1k+ parts

$1.898

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450

$1.998

$1.898

$1.898

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Newark

USA . 12 parts In-Stock

1+ parts

$3.020

100+ parts

$1.550

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-

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12

$3.020

$1.550

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Mouser Electronics

USA . 699 parts In-Stock

1+ parts

$3.070

100+ parts

$1.440

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$1.090

10k+ parts

$0.996

699

$3.070

$1.440

$1.090

$0.996

DigiKey

USA . 29,076 parts In-Stock

1+ parts

$3.770

100+ parts

$1.692

1k+ parts

$1.266

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29,076

$3.770

$1.692

$1.266

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Element14

Singapore . 22,161 parts In-Stock

1+ parts

$3.890

100+ parts

$2.800

1k+ parts

$1.960

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22,161

$3.890

$2.800

$1.960

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Arrow

USA . 125,000 parts In-Stock

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$0.890

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$0.890

Verical

USA . 125,000 parts In-Stock

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$1.394

125,000

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$1.394

Farnell

UK . 22,161 parts In-Stock

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$1.430

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$1.110

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22,161

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$1.430

$1.110

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Rochester

USA . 17,650 parts In-Stock

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$1.170

1k+ parts

$0.971

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$0.866

17,650

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$1.170

$0.971

$0.866

Avnet

USA . 10,000 parts In-Stock

1+ parts

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$0.741

10,000

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$0.741

RS (Exports)

UK . 1,600 parts In-Stock

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$1.296

1,600

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$1.296

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Digiode

USA . 365 parts In-Stock

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$0.988

100+ parts

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365

$0.988

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Nova Conductors

Japan . 20 parts In-Stock

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$2.245

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20

$2.245

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Chip Stock

USA . 151,320 parts In-Stock

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151,320

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Vyrian

USA . 14,896 parts In-Stock

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Rutronik

Germany . 7,500 parts In-Stock

1+ parts

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$0.808

7,500

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$0.808

Kruse Electronics AG

Switzerland . 5,000 parts In-Stock

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NAC Semi

USA . 2,500 parts In-Stock

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$1.200

2,500

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$1.200

Sensible Micro Corp

USA . 16 parts In-Stock

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16

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Prism Electronics

USA . 12 parts In-Stock

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12

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 19,374 parts In-Stock

1+ parts

$0.400

100+ parts

$0.384

1k+ parts

$0.368

10k+ parts

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19,374

$0.400

$0.384

$0.368

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Corohmni

South Africa . 141 parts In-Stock

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$0.582

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141

$0.582

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Aztec Data Supply Inc.

USA . 75 parts In-Stock

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$0.618

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75

$0.618

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Ampacity Inc.

Singapore . 17,742 parts In-Stock

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$0.630

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17,742

$0.630

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Semicontronic

India . 17,685 parts In-Stock

1+ parts

$0.630

100+ parts

$0.614

1k+ parts

$0.611

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17,685

$0.630

$0.614

$0.611

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Corphita

USA . 725 parts In-Stock

1+ parts

$0.936

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725

$0.936

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.998

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$1.898

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$1.898

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450

$1.998

$1.898

$1.898

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Argo Parts USA

USA . 434 parts In-Stock

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$2.245

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434

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Netroflash

USA . 100 parts In-Stock

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$2.245

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$2.200

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100

$2.245

$2.200

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Continental Prestige Electronics

USA . 24,087 parts In-Stock

1+ parts

$2.670

100+ parts

$1.710

1k+ parts

$1.050

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24,087

$2.670

$1.710

$1.050

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Microchip USA

USA . 8,761 parts In-Stock

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$9.112

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Lixinc

USA . 18,672 parts In-Stock

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GreenTree Electronics

Israel . 17,500 parts In-Stock

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RC Electronics

USA . 11,000 parts In-Stock

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$1.890

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$1.730

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$1.680

11,000

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$1.890

$1.730

$1.680

GlobX GmbH

Germany . 8,472 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 2,240 parts In-Stock

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Futuretech Components

Singapore . 1,017 parts In-Stock

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1,017

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Overview

Unleash the power of cutting-edge technology with the IPD200N15N3GATMA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-notch quality and reliability. This N-channel Power FET is designed for switching applications, offering enhanced performance and efficiency. With a maximum pulsed drain current of 200A and a minimum DS breakdown voltage of 150V, this transistor is a game-changer in the field. Whether you're looking to optimize your power management system or boost your device's capabilities, the IPD200N15N3GATMA1 is the perfect choice for superior performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have better conductivity and lower resistance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage, making it a versatile choice for different scenarios.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high efficiency.

Surface Mount: YES

Being surface-mountable makes it easy to integrate into compact designs, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this FET can handle high voltages, ensuring reliable performance in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and secure placement on a circuit board.

Terminal Form: GULL WING

The gull wing terminals provide a secure connection and easy soldering, ensuring a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching behavior, making them suitable for precise applications.

Maximum Pulsed Drain Current (IDM): 200 A

This high current rating allows for handling surge currents, making it suitable for applications with high power demands.

Avalanche Energy Rating (EAS): 170 mJ

The high avalanche energy rating ensures protection against voltage spikes, making it a reliable choice for rugged environments.

No. of Terminals: 2

With two terminals, this FET is easy to integrate into circuit designs and offers simplicity in connection.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact circuit designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it ideal for various applications.

Transistor Element Material: SILICON

Silicon-based FETs offer good electrical properties and reliability, making them a preferred choice for many applications.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring a reliable electrical connection.

Maximum Drain Current (ID): 50 A

With a high drain current rating, this FET can handle high-power applications with ease.

Maximum Drain-Source On Resistance: 0.02 ohm

The low on-resistance ensures minimal power loss and efficient operation in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and ensures easy integration into various applications.

Case Connection: DRAIN

The drain connection allows for easy thermal management, ensuring reliable performance under high-power conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPD200N15N3GATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

170 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

200 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD200N15N3GATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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