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IDC10D120T6MX1SA1

Infineon Technologies

IDC10D120T6MX1SA1 by Infineon Technologies

Infineon Technologies' IDC10D120T6MX1SA1 is a single diode rectifier with a max output current of 15A. It operates in temperatures ranging from -40 to 175°C and is designed for fast soft recovery applications.

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3

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1k+

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Vyrian

USA . 6,718 parts In-Stock

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Digiode

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Nova Conductors

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Modulus Dynamics

Lithuania . 24,765 parts In-Stock

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$0.056

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$0.054

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$0.052

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Corohmni

South Africa . 207 parts In-Stock

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$0.128

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Aztec Data Supply Inc.

USA . 4,795 parts In-Stock

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Ampacity Inc.

Singapore . 303 parts In-Stock

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AZTECH Wire

Italy . 562 parts In-Stock

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Component Stockers USA

USA . 788 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,519 parts In-Stock

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Microchip USA

USA . 3,453 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Discover the IDC10D120T6MX1SA1 by Infineon Technologies, a high-quality diode that offers incredible advantages for a wide range of applications. Manufactured by Infineon Technologies, a renowned leader in the industry, this diode is designed to provide fast soft recovery, delivering optimal performance even in extreme temperatures. With its single configuration and surface mount capability, it offers convenience and ease of use. Boasting a maximum output current of 15A and a maximum repetitive peak reverse voltage of 1200V, this diode ensures reliable and efficient operation. Its superior design and use of silicon as the diode element material guarantee exceptional durability and longevity. Trust the IDC10D120T6MX1SA1 to enhance your projects with its outstanding value, benefits, and advantages.

Feature Benefit Bullets

Config: SINGLE

This product's configuration as a single diode allows for efficient and precise usage in circuits.

Surface Mount: YES

With surface mount capability, this diode can be easily placed and soldered onto circuit boards, saving space and facilitating automated production processes.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures compatibility with standard mounting techniques and simplifies integration into various electronic systems.

No. of Terminals: 1

Having only one terminal simplifies the circuit connection process and reduces the chances of wiring mistakes.

Package Style (Meter): UNCASED CHIP

The un-cased chip package style provides flexibility in mounting and minimizes thermal resistance, ensuring efficient heat dissipation for better performance.

Application: FAST SOFT RECOVERY

This diode is specifically designed to have a fast and smooth recovery characteristic, making it suitable for high-frequency applications where fast response times are critical.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows this diode to withstand demanding environments, making it reliable and suitable for various applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this diode can operate in extreme cold conditions without compromising performance.

Terminal Position: UPPER

The upper terminal position facilitates easy access and connection in circuits, improving usability and installation.

Diode Type: RECTIFIER DIODE

This diode type serves the specific purpose of rectifying alternating current (AC) into direct current (DC), making it essential for power supply applications.

Maximum Output Current: 15 A

With a high maximum output current, this diode can handle larger electrical loads, making it suitable for power-intensive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the connection process and enables compatibility with modern and compact circuit designs.

No. of Elements: 1

Having one element streamlines circuit design and simplifies troubleshooting, making this diode an efficient choice.

Maximum Repetitive Peak Reverse Voltage: 1200 V

With a high maximum repetitive peak reverse voltage, this diode can handle high-voltage applications, enhancing its versatility and applicability.

No. of Phases: 1

The single-phase configuration of this diode ensures simplicity in circuit design and is suitable for most standard applications.

Diode Element Material: SILICON

Made from silicon, a widely-used semiconductor material, this diode offers reliable performance, excellent thermal stability, and good electrical characteristics, making it a preferred choice for many applications.

Technical Specifications

Diodes & Rectifiers IDC10D120T6MX1SA1 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Application:

FAST SOFT RECOVERY

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JESD-30 Code:

R-XUUC-N1

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

1

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

15 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

1200 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

IDC10D120T6MX1SA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.40

SB

8541.10.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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