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FM25L16B-DG

Infineon Technologies

FM25L16B-DG by Infineon Technologies

FM25L16B-DG by Infineon Technologies is a FRAM with 2KX8 organization and 16384 bit memory density. It operates at a max clock frequency of 20 MHz and has a min standby voltage of 2.7 V. This FRAM is commonly used in applications requiring high endurance and low power consumption.

Median Price

$1.866

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 85 parts In-Stock

1+ parts

$1.813

100+ parts

$1.573

1k+ parts

$1.238

10k+ parts

$1.226

85

$1.813

$1.573

$1.238

$1.226

Chip1Stop

Japan . 116 parts In-Stock

1+ parts

$1.920

100+ parts

$1.250

1k+ parts

$1.090

10k+ parts

$0.993

116

$1.920

$1.250

$1.090

$0.993

Farnell

UK . 90 parts In-Stock

1+ parts

$1.980

100+ parts

$1.720

1k+ parts

$1.410

10k+ parts

-

90

$1.980

$1.720

$1.410

-

Newark

USA . 504 parts In-Stock

1+ parts

$2.140

100+ parts

$1.840

1k+ parts

$1.320

10k+ parts

$1.310

504

$2.140

$1.840

$1.320

$1.310

Mouser Electronics

USA . 1,995 parts In-Stock

1+ parts

$2.410

100+ parts

$2.090

1k+ parts

$1.970

10k+ parts

$1.330

1,995

$2.410

$2.090

$1.970

$1.330

Flip Electronics (Authorized)

USA . 39,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,769

-

-

-

-

Verical

USA . 29,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.766

29,160

-

-

-

$1.766

Rochester

USA . 17,843 parts In-Stock

1+ parts

-

100+ parts

$1.270

1k+ parts

$1.140

10k+ parts

$1.070

17,843

-

$1.270

$1.140

$1.070

DigiKey

USA . 4,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.330

10k+ parts

-

4,062

-

-

$1.330

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 81 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

81

$1.387

-

-

-

Nova Conductors

Japan . 75 parts In-Stock

1+ parts

$1.609

100+ parts

-

1k+ parts

-

10k+ parts

-

75

$1.609

-

-

-

Flip Electronics

USA . 47,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

47,802

-

-

-

-

Vyrian

USA . 4,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,756

-

-

-

-

DigiKey Marketplace

USA . 4,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,062

-

-

-

-

Schukat

Germany . 160 parts In-Stock

1+ parts

-

100+ parts

$1.975

1k+ parts

$1.889

10k+ parts

-

160

-

$1.975

$1.889

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 556 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

-

556

$1.314

-

-

-

Continental Prestige Electronics

USA . 3,571 parts In-Stock

1+ parts

$1.609

100+ parts

-

1k+ parts

-

10k+ parts

$1.576

3,571

$1.609

-

-

$1.576

Argo Parts USA

USA . 378 parts In-Stock

1+ parts

$1.609

100+ parts

-

1k+ parts

-

10k+ parts

-

378

$1.609

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Perfect Parts

USA . 736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

736

-

-

-

-

Component Stockers USA

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

$1.530

10k+ parts

$1.300

28

-

$1.290

$1.530

$1.300

Overview

Experience unrivaled quality and performance with the FM25L16B-DG by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you the finest FRAMs on the market. With its advanced technology and durable packaging, this product is designed to meet your needs for various applications. Whether you're looking for high-speed data transfers or reliable memory storage, the FM25L16B-DG delivers unparalleled value, benefits, and advantages. Say goodbye to data loss and hello to seamless operation with this exceptional product. Upgrade your systems today and experience the difference that Infineon Technologies brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This FRAM product is made of high-quality plastic/epoxy material which provides excellent durability and protection to the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

With surface mount capability, this FRAM can be easily installed on a PCB, allowing for efficient and space-saving integration into various electronic devices or systems.

No. of Functions: 1

This FRAM offers a single integrated function, simplifying system design and reducing the complexity of the overall circuitry.

Package Shape: RECTANGULAR

The rectangular package shape of this FRAM enables easy placement and mounting, ensuring compatibility with standard manufacturing processes.

Operating Mode: SYNCHRONOUS

By operating in synchronous mode, this FRAM synchronizes data transfers, enabling faster and more efficient communication between the FRAM and other components in a system.

Nominal Supply Voltage / Vsup (V): 3.3

This FRAM operates reliably at a nominal supply voltage of 3.3V, making it compatible with a wide range of electronic systems and ensuring consistent performance.

No. of Terminals: 8

With 8 terminals, this FRAM provides sufficient connectivity options and facilitates easy integration into various circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style of this FRAM allows for efficient heat dissipation and easy installation in space-constrained applications.

Maximum Operating Temperature: 85 °C

This FRAM can withstand high operating temperatures up to 85°C, ensuring reliable performance even in demanding environments.

Organization: 2KX8

With an organization of 2KX8, this FRAM provides a memory capacity of 2K words, each consisting of 8 bits, offering ample storage space for data-intensive applications.

Minimum Standby Voltage: 2.7 V

The minimum standby voltage requirement of 2.7V allows for efficient power management, reducing energy consumption during standby periods.

Minimum Operating Temperature: -40 °C

This FRAM operates reliably at extremely low temperatures down to -40°C, making it suitable for use in cold environments or industrial applications.

Terminal Finish: PURE TIN

The use of pure tin as the terminal finish ensures excellent conductivity and corrosion resistance, enhancing the overall reliability and longevity of this FRAM.

Terminal Position: DUAL

With dual terminal positions, this FRAM offers flexibility in device orientation during installation, accommodating different PCB layouts and design requirements.

Write Protection: HARDWARE/SOFTWARE

The write protection feature, supported by both hardware and software, provides enhanced security for the stored data, preventing unauthorized modification or access.

Maximum Seated Height: 0.8 mm

With a maximum seated height of only 0.8mm, this FRAM enables a low-profile design, allowing for compact and space-efficient electronic products.

Maximum Clock Frequency (fCLK): 20 MHz

Operating at a maximum clock frequency of 20MHz, this FRAM ensures high-speed data read and write operations, contributing to overall system efficiency.

Width: 4 mm

The compact width of 4mm allows for easy integration of this FRAM into various PCB layouts and tight spaces, facilitating seamless incorporation into diverse applications.

Minimum Supply Voltage (Vsup): 2.7 V

This FRAM can operate reliably at a minimum supply voltage of 2.7V, providing flexibility in power supply choices and compatibility with low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand a maximum time of 30 seconds at peak reflow temperature, ensuring the reliability of solder joints during the manufacturing process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FRAM can endure high-temperature soldering processes, assuring robust mechanical connections.

Length: 4.5 mm

The compact length of 4.5mm allows for space-efficient placement and compatibility with various PCB designs, meeting the requirements of compact electronic systems.

Technology: CMOS

Based on complementary metal–oxide–semiconductor (CMOS) technology, this FRAM offers low power consumption, high-speed operation, and excellent noise immunity, contributing to optimal system performance.

Parallel or Serial: SERIAL

Operating in serial mode, this FRAM enables efficient data transmission and retrieval, making it suitable for applications requiring sequential access with reduced pin count complexity.

Terminal Form: NO LEAD

Utilizing a no-lead terminal form, this FRAM supports lead-free manufacturing processes, complying with environmental regulations and ensuring safer and eco-friendly production.

Maximum Supply Current: 3 mA

Consuming a maximum supply current of 3mA, this FRAM minimizes power usage, prolonging battery life and reducing energy costs in portable or low-power devices.

No. of Words: 2048 words

With a generous capacity of 2048 words, this FRAM provides ample storage space for critical data, allowing for extensive data logging or archival applications.

Memory Width: 8

The memory width of 8 bits offers efficient handling of data chunks, facilitating compatibility with standard data processing systems and simplifying data transfers.

Minimum Data Retention Time: 10

This FRAM ensures a minimum data retention time of 10 years, offering long-term data reliability and integrity, crucial for applications requiring prolonged data storage.

Terminal Pitch: 0.95 mm

With a terminal pitch of 0.95mm, this FRAM provides excellent electrical connectivity and compatibility with standard PCB manufacturing processes, ensuring easy integration into diverse electronic designs.

No. of Words Code: 2K

The no. of words code indicates a capacity of 2K words, allowing for significant data storage, making this FRAM suitable for applications that require substantial memory capacity.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this FRAM exhibits moderate moisture sensitivity, necessitating standardized handling and storage practices to maintain product reliability and quality.

Maximum Supply Voltage (Vsup): 3.6 V

This FRAM can reliably operate at a maximum supply voltage of 3.6V, providing flexibility and compatibility with a wide range of power supply options.

Endurance: 100000000000000 Write/Erase Cycles

Offering an outstanding endurance of 100 trillion write/erase cycles, this FRAM ensures long-lasting and reliable data storage, making it an ideal choice for applications that require frequent write operations.

Serial Bus Type: SPI

Operating through a Serial Peripheral Interface (SPI), this FRAM can be easily integrated into systems that utilize this popular communication protocol, enabling seamless data transfer.

Memory Density: 16384 bit

With a memory density of 16384 bits, this FRAM provides ample storage capacity for various data-intensive applications, ensuring efficient data handling and processing.

Memory IC Type: FRAM

Being a FRAM (Ferroelectric Random-Access Memory) type, this product combines the benefits of non-volatile memory and high-speed operation, offering superior performance and data retention capabilities.

Maximum Standby Current: 0.000006 Amp

Consuming a maximum standby current of only 0.000006 Amp, this FRAM ensures ultra-low power consumption during idle periods, enhancing energy efficiency and battery life.

Technical Specifications

FRAMs FM25L16B-DG attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

4.5 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2.7 V

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Write Protection:

HARDWARE/SOFTWARE

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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