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FF8MR12W2M1B11BOMA1

Infineon Technologies

FF8MR12W2M1B11BOMA1 by Infineon Technologies

Infineon's FF8MR12W2M1B11BOMA1 is a N-CHANNEL FET with 1200V DS breakdown voltage, ideal for switching applications. It features series connected, center tap configuration with 2 elements, built-in diode and thermistor. With max pulsed drain current of 300A, this MOSFET operates in enhancement mode at temperatures ranging from -40 to 150°C.

Median Price

$252.213

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

$238.200

100+ parts

$223.910

1k+ parts

$202.470

10k+ parts

-

4

$238.200

$223.910

$202.470

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Verical

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$266.226

10k+ parts

$249.170

15

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-

$266.226

$249.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 632 parts In-Stock

1+ parts

$226.290

100+ parts

-

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632

$226.290

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$357.337

100+ parts

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100

$357.337

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Vyrian

USA . 5,990 parts In-Stock

1+ parts

-

100+ parts

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5,990

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 22,598 parts In-Stock

1+ parts

$1.515

100+ parts

$1.454

1k+ parts

$1.394

10k+ parts

-

22,598

$1.515

$1.454

$1.394

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AZTECH Wire

Italy . 201 parts In-Stock

1+ parts

$12.873

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-

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201

$12.873

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Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$202.470

100+ parts

-

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10

$202.470

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-

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Corphita

USA . 667 parts In-Stock

1+ parts

$214.380

100+ parts

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667

$214.380

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Argo Parts USA

USA . 3,707 parts In-Stock

1+ parts

$357.337

100+ parts

$353.764

1k+ parts

$350.190

10k+ parts

$346.617

3,707

$357.337

$353.764

$350.190

$346.617

Continental Prestige Electronics

USA . 1,402 parts In-Stock

1+ parts

$357.337

100+ parts

-

1k+ parts

-

10k+ parts

$350.190

1,402

$357.337

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-

$350.190

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$357.337

100+ parts

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1,000

$357.337

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Microchip USA

USA . 5,833 parts In-Stock

1+ parts

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5,833

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Perfect Parts

USA . 319 parts In-Stock

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319

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Component Stockers USA

USA . 21 parts In-Stock

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21

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Overview

Unleash the power of innovation with the FF8MR12W2M1B11BOMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a minimum DS Breakdown Voltage of 1200V and a maximum Pulsed Drain Current of 300A, this product offers unmatched performance and reliability. Whether you're in the automotive, industrial, or renewable energy sector, this N-CHANNEL transistor is sure to meet your needs. Experience the value and benefits of cutting-edge technology with the FF8MR12W2M1B11BOMA1 from Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have lower on-resistance and higher efficiency compared to P-CHANNEL FETs, making them suitable for high power applications.

Minimum DS Breakdown Voltage: 1200 V

The high breakdown voltage allows for reliable operation in high voltage circuits, providing protection against voltage spikes and surges.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration provides redundancy and protection against failure, making the FET more reliable in critical applications.

Transistor Application: SWITCHING

Designed for efficient switching applications, allowing for fast turn-on and turn-off times, reducing power losses and improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 300 A

Capable of handling high current pulses, making it suitable for high-power applications where short bursts of high current are required.

No. of Terminals: 35

The higher number of terminals allow for more flexibility in circuit design and connection options, accommodating various system requirements.

Technical Specifications

Power Field Effect Transistors (FET) FF8MR12W2M1B11BOMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X35

No. of Elements:

2

No. of Terminals:

35

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

300 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

FF8MR12W2M1B11BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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