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DD800S17H4B2BOSA2

Infineon Technologies

DD800S17H4B2BOSA2 by Infineon Technologies

Infineon's DD800S17H4B2BOSA2 is a RECTIFIER DIODE with 1700V peak reverse voltage, 800A output current, and 2.1V forward voltage. It is used in applications requiring high power rectification such as industrial power supplies and motor drives due to its isolated case connection and separate dual-element configuration.

Median Price

$700.600

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7 parts In-Stock

1+ parts

$700.600

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7

$700.600

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Verical

USA . 7 parts In-Stock

1+ parts

$700.600

100+ parts

$658.563

1k+ parts

$616.525

10k+ parts

-

7

$700.600

$658.563

$616.525

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$825.919

100+ parts

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10

$825.919

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Digiode

USA . 550 parts In-Stock

1+ parts

$841.529

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550

$841.529

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Vyrian

USA . 1,922 parts In-Stock

1+ parts

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1,922

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TME

Poland . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$15.187

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404

$15.187

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Ampacity Inc.

Singapore . 101 parts In-Stock

1+ parts

$752.950

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101

$752.950

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Modulus Dynamics

Lithuania . 51 parts In-Stock

1+ parts

$797.200

100+ parts

$765.312

1k+ parts

$733.424

10k+ parts

-

51

$797.200

$765.312

$733.424

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Corphita

USA . 660 parts In-Stock

1+ parts

$797.238

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660

$797.238

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Microchip USA

USA . 5,358 parts In-Stock

1+ parts

$933.086

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5,358

$933.086

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Enhance your electronic designs with the DD800S17H4B2BOSA2 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality diodes and rectifiers that are perfect for a wide range of applications. Whether you need reliable power conversion or circuit protection, this product offers unmatched performance and durability. Say goodbye to worries about overheating or fluctuating currents, as the DD800S17H4B2BOSA2 ensures stable operation even in extreme temperatures. Trust in Infineon's expertise and invest in a product that truly delivers value and peace of mind.

Feature Benefit Bullets

Config: SEPARATE, 2 ELEMENTS

Having separate 2 elements provides redundancy and helps improve overall system reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easier mounting and integration into various electronic systems.

No. of Terminals: 4

Having 4 terminals allows for flexible connection options and easier integration into circuits.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy mounting and secure attachment.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures proper functionality even in cold environments.

Terminal Position: UPPER

Upper terminal position makes it easier for installation and connection in electronic circuits.

Case Connection: ISOLATED

Isolated case connection helps in preventing electrical interference and ensures safety in operation.

Diode Type: RECTIFIER DIODE

Rectifier diodes are essential for converting alternating current (AC) into direct current (DC) efficiently.

Maximum Forward Voltage (VF): 2.1 V

Low forward voltage drop of 2.1V ensures minimal power loss and efficient operation.

Maximum Output Current: 800 A

High maximum output current of 800A allows for handling heavy loads with stability and reliability.

No. of Elements: 2

Having 2 elements enhances performance and provides redundancy for improved reliability.

Maximum Repetitive Peak Reverse Voltage: 1700 V

High maximum reverse voltage of 1700V ensures protection against voltage spikes and surges.

Diode Element Material: SILICON

Silicon diode element material offers high efficiency, reliability, and longevity in operation.

Technical Specifications

Diodes & Rectifiers DD800S17H4B2BOSA2 attributes and parameters. Explore more Diodes & Rectifiers devices from Infineon Technologies

Specs

Application:

GENERAL PURPOSE

Case Connection:

ISOLATED

Config:

SEPARATE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

2.1 V

JESD-30 Code:

R-XUFM-X4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

800 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Repetitive Peak Reverse Voltage:

1700 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

Trade Compliance

DD800S17H4B2BOSA2 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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